A wiring board according to the present disclosure includes a core layer including core electrical conductor layers on upper and lower surfaces of a core insulating layer, a first build-up portion, a second build-up portion, a first mounting region, and a second mounting region. The first build-up portion includes a first build-up insulating layer and a first build-up electrical conductor layer connected to the first mounting region. The second build-up portion includes a second build-up insulating layer and a second build-up electrical conductor layer connected to the second mounting region. The second build-up insulating layer includes a margin for adhesion between the second build-up insulating layers or between the second build-up insulating layer and the core insulating layer. The second build-up electrical conductor layer includes an electrical conductor layer for grounding, a first opening, and a signal pad located inside the first opening.

A switching power supply is mounted on a printed circuit board. A first wiring layer of the printed circuit board includes a DC line through which a DC voltage is supplied, and a first ground region and a second ground region formed at a distance from the DC line and with the DC line interposed between them. A lower-layer ground region is formed in a second wiring layer. An insulating layer includes multiple first through holes provided along one side of the first ground region so as to electrically connect the first ground region and the lower-layer ground region, and multiple second through holes provided along one side of the second ground region so as to electrically connect the second ground region and the lower-layer ground region.

Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supported by the housing and include a conductive pathway extending around at least part of a perimeter of a first side of the circuit board. The conductive pathway can be electrically coupled to an electrical ground for the circuit board. The one or more controllers can be mounted on the circuit board and activate and deactivate the negative pressure source.

A mounting structure for mounting inductors to suppress cross talk and a stub effect due to a mounting land, and reduce deterioration of signal transmission characteristics. A first Bias-T inductor is mounted on a circuit board with one electrode terminal connected to a first mounting land with an axial direction of the first Bias-T inductor oriented perpendicular to the first mounting land and the one electrode terminal extends along the first mounting land. A second Bias-T inductor is mounted on the circuit board in the vicinity of the first Bias-T inductor with one electrode terminal connected to a second mounting land with an axial direction of the second Bias-T inductor inclined by 90° with respect to the axial direction of the first Bias-T inductor and the second Bias-T inductor is oriented perpendicular to the second mounting land and the one electrode terminal extends along the second mounting land.

It is desirable to improve a longevity and reliability of a substrate used within an IC package. By modifying a design of the one or more layout masks used to create planes within a substrate, the resulting planes may have a non-straight pattern on the edges of each plane and may include a predetermined pattern of open spaces filled with dielectric materials in each plane. The improved mechanical strength of the patterned planes can effectively compensate the effect of mismatched thermal expansion during IC testing and deployment, resulting in increased durability and longevity of the package substrates.

An electronic device includes a housing, a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate. The interposer includes a substrate, a first surface, a second surface, and a side surface. The interposer further includes a plurality of first conductive pads, a plurality of second conductive pads, a plurality of conductive posts, a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV), and a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including pads, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the pads, and plating bumps formed on the pads such that each plating bump includes a base plating layer formed in a respective one of the openings, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer. The plating bumps are formed such that the base plating layer has a side surface including a portion protruding from the solder resist layer, that the intermediate layer has a thickness in a range of 2.7 to 7.0 μm, and that the top plating layer has a hemispherical shape and is covering only an upper surface of the intermediate layer.

Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supported by the housing and include a conductive pathway extending around at least part of a perimeter of a first side of the circuit board. The conductive pathway can be electrically coupled to an electrical ground for the circuit board. The one or more controllers can be mounted on the circuit board and activate and deactivate the negative pressure source.

The present invention may be embodied as a DC-DC step-up converter assembly comprising a multiple-layer PCB and a converter circuit. The converter circuit comprising a boost controller, an inductor, a capacitor, and a resistor. The boost controller, inductor, capacitor, and resistor are all supported on one side of the multiple-layer PCB. The boost controller, inductor, capacitor, and resistor are configured to operate at a switching frequency of substantially between 50 kHz and 800 kHz