A wiring board includes a plurality of insulating layers each being made of flexible insulating resin, and a conductor layer that is laminated on the plurality of insulating layers and that has a conductor pattern. The conductor layer includes a conductor pattern that has a certain shape in which a plurality of unit patterns are connected in plan view. The unit pattern includes a U-shaped pattern, an inverted U-shaped pattern that is arranged such that an opening side is located away from an opening side of the U-shaped pattern, and a straight line pattern that connects center portions of the U-shaped pattern and the inverted U-shaped pattern.

According to various embodiments, a printed circuit board may include: a first wiring layer including at least one first signal line and at least one first dummy line; and a second wiring layer arranged on the first wiring layer and including at least one second signal line and at least one second dummy line, wherein when the printed circuit board is viewed from above, the at least one first signal line may be arranged to overlap, at least in part, the at least one second dummy line, and the at least one second signal line may be arranged to overlap, at least in part, the at least one first dummy line.

Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

What is provided is an adapter plate for HF structures, which is set up for being disposed between a back of a circuit board and a reflector, wherein the adapter plate is electrically conductive, and the adapter plate has an opening or a cavity at every location where an element is passed through the circuit board to the side of the adapter plate, wherein at least one element is passed through the circuit board exclusively for ground contacting.

A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.

An electronic device including a shielding structure is provided. The electronic device includes a housing, a first board disposed in an inner space of the housing and including a first electrical element and a first ground layer, a second board disposed in the inner space to be spaced apart from the first board and including a second electrical element, and an interposer disposed between the first board and the second board so as to electrically connect the first board and the second board to each other. The second board includes a first surface facing the first board, a second surface facing away from the first surface, insulating layers disposed between the first surface and the second surface, first slits formed at a predetermined interval in a first conductive area disposed in a first insulating layer among the insulating layers, and second slits formed at a predetermined interval in a second conductive area disposed in a second insulating layer between the first insulating layer and the second surface. The first slits are disposed at a position where the plurality of first slits do not overlap the plurality of second slits in case the second board is viewed from above.

A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.

A printed circuit board including a series-wound inductor and two capacitors to reduce the susceptibility of a printed circuit board to simultaneous switching noise includes a ground layer; a power layer defining a slot loop to isolate a metal plate within, and a via hole coupled between the metal plate and the ground layer. An electronic device with the printed circuit board is also disclosed.

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

A printed circuit board (PCB) structure is provided for a solid state drive. In an embodiment, a solid state drive includes top and bottom layers, multiple intermediate layers and a ground cage. Each of top and bottom layers includes a plurality of components for operation of the solid state drive. The multiple intermediate layers enable electrical signals to pass between components on the top and bottom layers, one of the multiple intermediate layers including a power plane having a high voltage relative to each of the other planes. The ground cage shields signal traces on the same layer as the power plane and planes in adjacent layers from noise generated by the power plane.