The present subject matter relates to a battery module for use in a vehicle. The battery module may include a housing, a plurality of battery cells disposed within the housing, and solid state pre-charge control circuitry that pre-charges a direct current (DC) bus that may be coupled between the battery module and an electronic component of the vehicle. Furthermore, the solid state pre-charge control circuitry may include solid state electronic components as well as passive electronic components.

A circuit board includes: a substrate; a first power feed line disposed so as to be close to a plurality of radiating elements provided on a surface of the substrate and to extend in a first direction; a first connection conductor extending in a second direction orthogonal to the first direction, one end of the first connection conductor being connected to the first power feed line substantially at its central portion in the first direction; and a second power feed line that has a first line part extending in a third direction orthogonal to the second direction, the first line part joining to another end of the first connection conductor, and also has a second line part branching from the first line part, the second line part joining to the other end from a third direction side.

A battery module includes a housing, a plurality of battery cells disposed in the housing, and a printed circuit board (PCB) assembly disposed in the housing. The PCB assembly includes a PCB and a shunt disposed across a first surface of the PCB. A second surface of the shunt directly contacts the first surface of the PCB, and the shunt is electrically coupled between the battery cells and a terminal of the battery module.

A battery module includes a lower housing and a plurality of battery cells. The plurality of battery cells are electrically coupled together to produce a voltage. A lid assembly is disposed over the battery cells and is coupled to the lower housing. The lid assembly includes a lid and a plurality of bus bar interconnects mounted on the lid. A printed circuit board (PCB) assembly is disposed on and coupled to the lid assembly, and the PCB assembly includes a PCB. A cover is disposed over and coupled to the lower housing to hermetically seal the battery module.

Electronic devices that include a routing substrate with lower inductance path for a capacitor, and related fabrication methods. In exemplary aspects, to provide lower interconnect inductance for a capacitor coupled to a power distribution network in the routing substrate, an additional metal layer that provides an additional, second power plane is disposed in a dielectric layer between adjacent metal layers in adjacent metallization layers. The additional, second power plane is adjacent to a first power plane disposed in a first metal layer of one of the adjacent metallization layers. The disposing of the additional metal layer in the dielectric layer of the metallization layer reduces the thickness of the dielectric material between the first and second power planes coupled to the capacitor as part of the power distribution network. This reduced dielectric thickness between first and second power planes coupled to the capacitor reduces the interconnect inductance for the capacitor.

A transmission line member includes a base body extending along a transmission direction of a high-frequency signal, and a first transmission line, a second transmission line, and a third transmission line. The base body includes a first portion including the first transmission line, a second portion including the second transmission line, and a third portion including the third transmission line. The second portion is connected between the first and third portions. A thickness of the second portion is smaller than a thickness of the first and third portions. The second transmission line includes only a conductor pattern extending more in the transmission direction than in a direction of the thickness.

An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

A battery module includes a housing, a plurality of battery cells disposed in the housing, and a printed circuit board (PCB) assembly disposed in the housing. The PCB assembly includes a PCB and a shunt disposed across a first surface of the PCB. A second surface of the shunt directly contacts the first surface of the PCB, and the shunt is electrically coupled between the battery cells and a terminal of the battery module.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

An electronic circuit board includes a substrate having a multilayer structure including a ground layer, has at least one configuration in which, in a ground layer closest to a signal terminal of an oscillator, a region overlapping a signal terminal in a plan view is a non-forming region of a ground electrode, in a ground layer closest to a first wiring connecting the signal terminal of the oscillator and an input portion of an amplifier, a region overlapping the first wiring in the plan view is a non-forming region of a ground electrode, and in a ground layer closest to a second wiring connecting the signal terminal of the oscillator and an output portion of the amplifier, a region overlapping the second wiring in the plan view is a non-forming region of a ground electrode.