A flexible printed circuit board includes a power wiring layer transmitting power and a signal wiring layer insulated and stacked over or under the power wiring layer. The flexible printed circuit board may also include an upper wiring layer and a lower wiring layer insulated and stacked each other, and the power wiring layer and the signal wiring layer are provided between the upper wiring layer and the lower wiring layer.

An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed. Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.

A method and apparatus for arranging fuses in a printed circuit board includes a power input configured to connect to a power source, at least one electrical component connected to the power input, a first output connected to the at least one electrical component and configured to connect to a load, and a fuse disposed between the at least one electrical component and the first output, and having a first trip rating.

A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the data line layer and the ground layer and between the ground layer and the power line layer, respectively, wherein the ground layer comprises a common ground and a chassis ground electrically insulated from the common ground.