A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.

An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.

An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and second region of second layer, while contacting second layer, and being separated from second insulating layer by air gap, and a wireless communication circuit electrically connected to first conductive strip and configured to transmit and/or receive radio frequency (RF) signal.

A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.

An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.

The electronic circuit device includes: a first wiring pattern which is formed on a first main surface of a circuit board, has circuit elements including a switching element and mounted along a predetermined direction, and includes a virtual shortest current path connecting the circuit elements to each other along the predetermined direction; a second wiring pattern which is formed on a second main surface, and includes an opposing current path that opposes an area where the virtual shortest current path is formed; vias electrically connecting the first and second wiring patterns; and vias for heat transfer, connecting a mount area for the switching elements on the first main surface with an area on a side of the opposing current path on the second main surface. The heat dissipation member is in contact with the second main surface.

A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.

A printed circuit board may comprise a first layer in which a first signal transmission path is formed, a second layer disposed in one surface direction of the first layer and including a first ground for providing a return current path for a signal transmitted from the first layer, a third layer in which a second signal transmission path is formed and a fourth layer disposed in the other surface direction of the third layer and including a second ground for providing a return current path for a signal transmitted from the third layer.

A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.