An electronic apparatus which achieves ease of incorporating flexible boards into the electronic apparatus and ease of impedance control at the same time. A first flexible board and a second flexible board are placed along a structure having a bent portion and a flat portion. Differential signal wires are wired on one surface of the first flexible board placed between the structure and the second flexible board, and first ground wires for impedance control of the differential signal wires are wired on the other surface and on a rear side of the differential signal wires. Second ground wires for impedance control of the differential signal wires are wired on one surface of the second flexible board the one surface of the first flexible board faces. A wiring density of the first and second ground wires differs between an area along the bent portion and an area along the flat portion.

Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.

An electronic device according to various embodiments may comprise: a housing; an antenna structure positioned in the housing; and a wireless communication circuit. The antenna structure may comprise: a first conductive layer comprising a first opening; a second conductive layer positioned in parallel with the first conductive layer, the second conductive layer comprising a second opening which at least partially overlaps with the first opening when the first conductive layer is seen from above; a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer; a first insulating layer interposed between the first conductive layer and the third conductive layer; a second insulating layer interposed between the second conductive layer and the third conductive layer; a first conductive plate in the first opening, which is electrically separated from the first conductive layer; a second conductive plate in the second opening, which is electrically separated from the second conductive layer; a first conductive via electrically connected between the first conductive plate and the third conductive layer through the first insulating layer; and a second conductive via electrically connected between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 giga hertz (GHz) and 100 GHz and may be electrically connected to the antenna structure. Various embodiments may be possible.

An embodiment provides a circuit board including: a terminal part including a plurality of first terminals, a body part spaced apart from the terminal part and including a plurality of second terminals, and a wire part between the terminal part and the body part, wherein the wire part includes a power wire and a ground wire connecting the plurality of first terminals and the plurality of second terminals, and the ground wire is disposed more outward than the power wire, within the wire part.

An electronic apparatus which achieves ease of incorporating flexible boards into the electronic apparatus and ease of impedance control at the same time. A first flexible board and a second flexible board are placed along a structure having a bent portion and a flat portion. Differential signal wires are wired on one surface of the first flexible board placed between the structure and the second flexible board, and first ground wires for impedance control of the differential signal wires are wired on the other surface and on a rear side of the differential signal wires. Second ground wires for impedance control of the differential signal wires are wired on one surface of the second flexible board the one surface of the first flexible board faces. A wiring density of the first and second ground wires differs between an area along the bent portion and an area along the flat portion.

A system and method to automatically determine power plane shape in a printed circuit board (PCB) involve obtaining inputs. The inputs include a size and shape of the PCB, a set of sources, and a set of sinks associated with a power plane. The method also includes determining a center of charge (CoC) as a center of largest current density for the set of sources and the set of sinks, and creating a sub-shape corresponding with a path from each source of the set of sources and from each sink of the set of sinks to the CoC. The creating the sub-shape includes determining a width of a conductor in the path corresponding with each of the sub-shapes. The sub-shapes created for the set of sources and the set of sinks are combined as the power plane shape.

A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.

A method of providing power input to a flexible printed circuit. The method involves the step of bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection. In accordance with this teaching, power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area, rather than through individual control lines.

Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.