A signal transmitting apparatus includes a first line that is provided in one of plural layers of a board and transmits a signal by superimposing the signal on an electric power line that supplies electric power; a coupling section in which the electric power line is coupled to the first line and the first line is branched; plural second lines that branch off in the coupling section and are provided in another layer different from the one layer; and a conductive layer that is provided between the one layer and the other layer. The conductive layer has an opening that encompasses the coupling section in plan view, and the coupling section has a coupling line that has a larger width than the first line and plural through-holes that connect the coupling line and the plural second lines through the opening of the conductive layer.

A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.

Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.

A semiconductor device of the present invention includes: a substrate (12) that is annular or partially annular; a first phase control circuit (14) provided on the substrate (12), the first phase control circuit being configured to control a first phase of a plurality of phases of a motor; a second phase control circuit (15) provided on the substrate (12) so as to be adjacent to the first phase control circuit (14) in a circumferential direction of the substrate (12), the second phase control circuit (15) being configured to control a second phase of the plurality of phases of the motor, the second phase being different from the first phase; a power supply wiring (18) disposed on one of an outer circumferential side and an inner circumferential side of the first phase control circuit (14) and the second phase control circuit (15) in a radial direction of the substrate (12), the power supply wiring (18) being connected to the first phase control circuit (14) and the second phase control circuit (15), and the power supply wiring (18) extending in the circumferential direction of the substrate (12); and a ground winding (19) disposed on an other one of the outer circumferential side and the inner circumferential side of the first phase control circuit (14) and the second phase control circuit (15) in the radial direction of the substrate (12), the ground winding (19) being connected to the first phase control circuit (14) and the second phase control circuit (15), and the ground winding (19) extending in the circumferential direction of the substrate (12).

A signal transmitting apparatus includes a first line that is provided in one of plural layers of a board and transmits a signal by superimposing the signal on an electric power line that supplies electric power; a coupling section in which the electric power line is coupled to the first line and the first line is branched; plural second lines that branch off in the coupling section and are provided in another layer different from the one layer; and a conductive layer that is provided between the one layer and the other layer. The conductive layer has an opening that encompasses the coupling section in plan view, and the coupling section has a coupling line that has a larger width than the first line and plural through-holes that connect the coupling line and the plural second lines through the opening of the conductive layer.

Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

An electronic device and semiconductor package include a printed circuit board and a semiconductor device mounted thereon. The printed circuit board includes one or more thermally conductive vias for dissipating heat.

Provided is a printed circuit board having a breakdown detection pattern formed thereon for preventing illicit acquisition of sensitive data, the printed circuit board being configured so that false detection of a disconnection or a short in the breakdown detection pattern can be prevented. The printed circuit board (7) comprises a breakdown detection pattern layer (32) wherein a breakdown detection pattern is formed for detecting a disconnection and/or a shorting thereof, a first pattern layer (31) disposed more to a Y1 direction side than the breakdown detection pattern layer (32), a second pattern layer (33) disposed more to a Y2 direction side than the breakdown detection pattern layer (32), and signal pattern layers (34 to 36) disposed more to the Y2 direction side than the second pattern layer (33). Formed in the first pattern layer (31) are a grounding pattern and a power source pattern covering the breakdown detection pattern from the Y1 direction side. Formed in the second pattern layer (33) are a grounding pattern and a power source pattern covering the breakdown detection pattern from the Y2 direction side.

Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.