A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

The invention relates to an electrical connection system in LED profile systems (60) and its components and the assembly of said components. The connection system comprises, in particular, an electrical connection element (40) for supplying electrical power to an LED strip (70) which is in the form of a flexprint strip (41). The connection element (40) has a supply connection length region (43) with exposed longitudinal conductor tracks (42), an LED connecting length region (44) with longitudinal conductor tracks (42) in the positions of the connections of the LED strip (70) and an adhesive area (45) on the rear side of the connection element (40). Here, the electrical connection element (40) can be folded over at a bending point (46) between the supply connection length region (43) and the LED connecting length region (44), so that they come to rest on opposite sides of the profile system (60). As an alternative or in addition, the electrical connection system also comprises an associated electrical connector (50) for supplying electrical power to the LED strip (70) which has a PCB (51) or a leadframe (51) encapsulated by injection moulding and having spring contacts (52) on a bottom side (54) and a cable outlet (67) with cable connections (53) on a top side (55), wherein a clip element (56) is formed for attachment to the profile system (60).

The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.

A signal collection and power connection assembly of a power battery module, a power battery module and a vehicle are provided. The assembly includes a substrate, a power connection member fixed on the substrate, a power connection line formed by a first sheet-like conductor disposed on the substrate, a signal collection line formed by a second sheet-like conductor disposed on the substrate, and a signal collection member disposed on the substrate and coupled with the signal collection line. A terminal of the power connection line is coupled with the power connection member, and a terminal of the signal collection line is coupled with the power connection member.

The present invention relates to a printed circuit board and an image display device including same. The printed circuit board according to an embodiment of the present invention includes a power pattern layer, a ground pattern layer, and a wiring pattern layer on which circuit elements are disposed, wherein the wiring pattern layer includes a signal line pattern through which an electrical signal is transmitted, and a ground pattern electrically disconnected from the signal line pattern and having at least one via hole formed therein which is electrically connected to the ground pattern layer, wherein the signal line pattern comes into contact with a first end of an overvoltage cutoff element that operates in response to an overvoltage, greater than or equal to a predetermined voltage value, being applied to the signal line pattern, wherein the ground pattern includes a first detailed pattern coming into contact with a second end of the overvoltage cutoff element, a second detailed pattern having the via-hole formed therein, and a plurality of third detailed patterns electrically connecting the first detailed pattern and the second detailed pattern, wherein the via hole is formed in a remaining region except for a plurality of first regions of the second detailed pattern that extend from each of the third detailed patterns in a length direction of each of the plurality of third detailed patterns. Various other embodiments are possible.

A multilayer substrate includes a resin multilayer body including, in a lamination direction, first and second laminate portions respectively including first and second thermoplastic resin layers, and a first interlayer connection conductor extending through the first thermoplastic resin layer. A storage elastic modulus of the first thermoplastic resin layer is lower than that of the second thermoplastic resin layer at a measurement temperature equal to or higher than a minimum melting point among melting points of metallic elements included in the first interlayer connection conductors and equal to or lower than melting points of the first thermoplastic resin layer and the second thermoplastic resin layer.

A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

A light emitting device includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion. The groove portion is formed between the plurality of wiring portions spaced apart from each other, and includes a first groove portion, a second groove portion, and a third groove portion extending in a direction intersecting the first and second groove portions. The first and third groove portions are connected to each other with a curve. The second and third groove portions are connected to each other with a curve. The sealing resin member seals the light emitting element and the substrate. The sealing resin member is arranged on the third groove portion and spaced apart from the first groove portion and the second groove portion.