A connector attached multi-conductor cable includes a multi-conductor cable and a connector, and the connector includes a circuit board including a first surface, a second surface, and a third surface provided at a tip in a direction of connector insertion to connect the first surface to the second surface. The circuit board includes a first group of pads including a plurality of first pads provided on the first surface and connected to central conductors of the electric wires; a second group of pads including a plurality of second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first surface and the second surface, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided on a side apart from the first group of pads in the second direction with respect to the second group of pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

A wiring board includes a substrate, pads formed on an electronic-component mounting surface of the substrate, and a resin insulation layer covering the electronic-component mounting surface and having opening portions such that the opening portions are exposing the pads, respectively. The pads include a non-solder mask defined pad having a wiring portion and a non-solder mask defined pad having no wiring portion, and the opening portions are formed such that the non-solder mask defined pads have exposed conductor areas which have substantially same areas inside the opening portions.

A battery, for example, a rechargeable battery (e.g. lithium ion battery) having a casing with battery terminals. The casing, for example, includes an upper section, middle section, and lower section connected together. The battery can be connected to one or more battery trays having the same height or different heights for various applications.

Provided is a land for a surface mounted component that includes a plurality of land regions respectively having different width. Land regions included in the plurality of land regions are combined with one another with centers in a width direction aligned in order conforming to the widths and are jointed into one land. A cutout shape is provided in a center in the width direction on a side opposed to an adjacent or overlapping side of a land region having a larger width of adjacent or partially overlapping two land regions in the plurality of land regions joined into the one land.

The present disclosure provides a flexible circuit board. The flexible circuit board includes a substrate; a conductive layer, disposed on the substrate; and a cover layer, disposed on a side of the conductive layer facing away from the substrate. The flexible circuit board is provided with a through hole penetrating through the flexible circuit board in the thickness direction. The cover layer includes a hollowed-out region located at least at an edge of one side of the through hole. The conductive layer includes an electrostatic discharge section exposed in the hollowed-out region.

A display device is provided and includes a display panel and a flexible printed wiring substrate. The display panel is provided with a binding structure. The binding structure includes a plurality of first connection terminals arranged along a width direction of the display panel; and a flexible printed wiring substrate is electrically connected to the bonding structure of the display panel. Each of the first connection terminals is obliquely disposed along a lateral edge of the width direction of the display panel, and adjacent lateral edges of two of the adjacent first connection terminals along the width direction of the display panel are parallel to each other.

A display device and a manufacturing method thereof are provided. The display device includes a display panel and a flexible circuit board electrically connected with the display panel. The flexible circuit board includes a first circuit board, a second circuit board and a conductive portion; the first circuit board includes a first substrate, and a main contact pad, a first wire and a second wire provided on the first substrate; the second circuit board includes a second substrate, a relay contact pad and a third wire provided on the second substrate; and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.