An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.

The present disclosure relates to a chip, a circuit board and an electronic device. The chip includes a chip substrate and a plurality of pads arrayed on the chip substrate. At least one of the plurality of pads on the chip is a polygonal pad.

According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.

Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.

A display device includes a display panel including a plurality of display pads, a portion of the plurality of display pads being extended along a first direction and arranged along a second direction intersecting the first direction, and a flexible circuit board including a plurality of substrate pads electrically connected to the plurality of display pads, and a plurality of dummy pads spaced apart from the plurality of substrate pads and arranged in parallel to the plurality of substrate pads along the second direction, a portion of the plurality of dummy pads have an extension length in the first direction and a width in the second direction substantially same as an extension length in the first direction and a width in the second direction, respectively, of the plurality of substrate pads.

A connector attached multi-conductor cable includes a multi-conductor cable and a connector that includes a circuit board including first to third surfaces. The circuit board includes first pads provided on the first surface and connected to central conductors of wires; second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first and second surfaces, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided apart from the first pads in the second direction with respect to the second pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.

A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

A strain gauge includes a flexible substrate, a resistor, and electrodes. Each electrode includes first patterns juxtaposed at predetermined intervals and electrically connected to each other. Second patterns of which longitudinal directions are toward a same direction as a longitudinal direction of each of the first patterns are disposed between opposing electrodes. The second patterns are electrically floating dummy patterns. The second patterns of which the longitudinal directions are toward a same direction as the longitudinal direction of each first pattern are disposed, the second patterns being interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode. The plurality of second patterns are interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode.