A pad 11 is disposed at an end point of a first wiring 17 provided on a board 15, is connectable to one of N (N: an integer of two or more) wirings provided on the board 15 via a resistor or a conductor, and has (N+1) sides that are disposed by deforming respective sides of an equilateral polygon having (N+1) sides into convex sides each having a radius of curvature that is larger than a radius of curvature of a circumscribed circle of the equilateral polygon.

A downhole system includes a controller located at the surface, a gun string located in a wellbore, the gun string including plural gun assemblies, a thru-line connecting the controller to the gun string, and a detonator block attached to a given gun assembly. The detonator block includes an addressable switch assembly. The gun assembly includes an end plate mechanism that electrically connects to the detonator block. The detonator block has at least one spring-loaded contact connected to the thru-line and the end plate mechanism includes a round electrical contact made as a printed circuit board, and the spring-loaded contact touches the printed circuit board.

A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.

A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.

A non-rectangular connection pad for coupling discrete components to connection pads reduces the capacitance in the connection pad area, and thus maintains a more uniform characteristic impedance along the length of the trace. The pad shape is changed to reduce the area of the pad. The reduced area reduces or eliminates change in characteristic impedance of the trace incorporating the connection pad and discrete component attached to the connection pad. An irregular pad shape may be used to decrease the soldering area of the discrete component, while still maintaining wettability of the solder. One example of such a non-rectangular connection pad is a C-shaped connection pad. Such connection pad shapes can be used on traces for high-speed circuits (e.g., PCIe, USB, SATA, and other traces carrying signals above 1 GHz).

A control unit that controls a motor includes a semiconductor device, the semiconductor device includes a semiconductor package including a plurality of first electrodes, a wiring board including a plurality of second electrodes arranged so as to correspond to each of the plurality of first electrodes, and solder joints connecting the plurality of first electrodes and the plurality of second electrodes, and a tip end of a second electrode arranged at an outermost corner of the wiring board is located outside an outer peripheral end of the semiconductor package.

An implantable electronic device includes a flexible circuit board, one or more circuit components attached to the flexible circuit board and configured to convert electrical energy into electrical pulses, and one or more electrodes attached to the flexible circuit board without cables connecting the electrodes to each other or to the flexible circuit board, the one or more electrodes configured to apply the electrical pulses to a tissue adjacent the implantable electronic device.

A living body-attachable electrode includes a substrate that has a first main surface and a second main surface and is made of a material having stretchability, a first electrode pair that is formed on/in the first main surface and includes two opposite electrodes, a second electrode pair that is formed on/in the first main surface and includes two opposite electrodes sandwiching the first electrode pair, and a plurality of gel electrodes that are formed on the second main surface and are in a one-to-one correspondence with the electrodes in the first and second electrode pairs. Each of the electrodes in the first and second electrode pairs and corresponding one of the gel electrodes are electrically connected to each other via a plurality of via conductors penetrating through the substrate.

A driving module including a circuit board, a rotating member rotatably disposed on the circuit board, and a power source mechanically linked to the rotating member and electrically connected to the control circuit is provided. The circuit board has a control circuit, a first conductive portion, and a plurality of second conductive portions. The first conductive portion and the second conductive portions are electrically connected to the control circuit respectively. The rotating member has a first abutment and a second abutment electrically connected to each other. The power source is controlled by the control circuit to rotate the rotating member relative to the circuit board. The first abutment constantly abuts the first conductive portion, and the second conductive portions are on a rotating path of the second abutment. A restoration method and an imaging device are also provided.

A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.