Disclosed is a display device comprising: a display panel; a driver chip; the driver chip is provided with a plurality of chip pins disposed spaced from each other, and the distance between at least two adjacent chip pins is different from the distance value between the other two chip pins; and a driving circuit board, the driving circuit board is provided with a plurality of circuit board contact points, and a circuit board contact point is connected to a chip pin correspondingly.

An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.

An imaging module includes an electric cable including a plurality of wirings, an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable, and a flexible wiring board configured to electrically connect the imager and the electric cable. The wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager. At least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions.

A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.

A method for controlling a target switch assembly in a chain of switch assemblies includes distributing the chain of switch assemblies in a wellbore; placing a controller at a head of the wellbore; making a first decision, at the controller, to actuate a corresponding detonator of the target switch assembly; transmitting, from the controller to the target switch assembly, a fire command to activate the corresponding detonator; and making a second decision, locally, at the target switch assembly, to activate the detonator, after the fire command from the controller is received.

Various embodiments relating to a pogo module comprising a pogo pin for maintaining an electrical connection state when an electronic device is rotated and not rotated are disclosed, and according to one embodiment, the pogo module comprises: first and second housings; module circuit boards provided inside the first and second housings; at least one pogo pin provided to the module circuit board and comprising a rotatable structure electrically connected to at least one electrode pattern included in a printed circuit board of the electronic device; and a support body coupled to the module circuit board to support the at least one pogo pin, wherein the rotatable structure can maintain an electrical connection state with the at least one electrode pattern when the electronic device is rotated or not rotated. In addition, various other embodiments are possible.

A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.

An electronic device includes a first substrate, a second substrate, plural conductive pads, plural hole structures, plural connection pads and plural conductive structures. Hole structures penetrate through the first and second substrates, and are arranged corresponding to the conductive pads. Second ends of hole structures are located at the second substrate, and the corresponding conductive pad is exposed by one of the second ends. Connection pads enclose first ends of hole structures. Conductive structures are arranged in the hole structures and electrically connected to corresponding conductive pads and connection pads. The second diameter portion of each conductive structure penetrates through first substrate and conductive pad and is electrically connected to corresponding connection pad and conductive pad, and first diameter portion thereof penetrates through second substrate and is electrically connected to corresponding conductive pad. Each conductive pad defines an opening, which is exposed by second end of corresponding hole structure.

A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.

A wiring circuit board includes a metal supporting substrate, an insulating layer, and a conductive layer in this order in a thickness direction. The conductive layer includes at least one terminal portion and a wiring portion extending from the terminal portion. The metal supporting substrate has an opening portion. The opening portion penetrates the metal supporting substrate in the thickness direction and faces the terminal portion through the insulating layer. The opening portion has a first opening peripheral edge on one side in the thickness direction and a second opening peripheral edge on the other side in the thickness direction. In a projected view in the thickness direction, the second opening peripheral edge is disposed outside the first opening peripheral edge and extends along the first opening peripheral edge.