A wiring board including a component mounting portion with an increased strength is provided. In addition, an electronic device and an electronic module with high reliabilities are provided. The wiring board includes a base having a first face and a conductor positioned on the first face. The conductor has a region in which a plurality of first protrusions are positioned on a surface of the conductor, the plurality of first protrusions protruding in a same oblique direction that is oblique to a direction normal to the first face. The electronic device and the electronic module include the above-described wiring board and an electronic component mounted on the wiring board.

A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.

A display device includes a display panel including first pads in a first row and second pads in a second row, a driving circuit board, a first connection circuit board including a first output portion on which first output pads bonded to the first pads of the display panel are disposed, a first input portion on which first input pads bonded to the driving circuit board are disposed, and a first protruding portion, and a second connection circuit board including a second output portion which overlap at least a portion of the first output portion and on which second output pads bonded to the second pads of the display panel are disposed, and a second input portion on which second input pads bonded to the driving circuit board are disposed. At least a portion of the first protruding portion is disposed on the second input portion.

An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.

A ruggedized direct-view LED display system (100) includes a bonding matrix (215) that helps secure an array of LED chips (205) to a printed circuit board (PCB) (210). The bonding matrix may consist of an epoxy or other resin deposited on the surface (310) of the PCB after soldering the LED chips to the PCB. The bonding matrix has a thickness that is less than the thickness of the LED chips so that light-emitting outer portions (415) of the LED chips are not covered by the bonding matrix material. A method of forming the bonding matrix is also disclosed, including depositing bonding matrix material onto the PCB between the LED chips using nozzles or needles, optionally wicking excess bonding matrix material, and optionally degassing the bonding matrix material before curing it to form the bonding matrix.

Technologies for applying gold-plated contact pads to circuit boards are disclosed. In one embodiment, an array of gold-plated contact pads is prepared on a flexible substrate. The array of gold-plated contact pads can then be transferred to a circuit board, such as by soldering the gold-plated contact pads to the circuit board. In another embodiment, an array of contact pads are prepared on a top and bottom surface of a substrate, and vias are added to connect the contact pads on the top and bottom surfaces. The top array of contact pads are gold-plated. The bottom array of contact pads are mated to a circuit board. Techniques described herein allow for gold-plated contact pads to be applied to a circuit board without requiring the entire circuit board to undergo a gold plating process, which may reduce manufacturing costs.

A sensor device adapted to suit curved surfaces includes a flexible substrate, a plurality of sensing units and a plurality of connecting lines. The flexible substrate includes a plurality of connecting sections, wherein each of the plurality of connecting sections comprises at least one closed hollow region. A plurality of sensing units, disposed on the flexible substrate and arranged in an array; and a plurality of connecting lines, disposed on the flexible substrate. Each of the plurality of connecting lines is connected to two adjacent ones of the plurality of sensing units, and the plurality of connecting sections are respectively overlapped with the plurality of connecting lines.

A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

A board mount connector includes: a housing having a press-fitting hole; and a terminal press-fitted into the press-fitting hole. The terminal includes: a first terminal portion including a first contact portion contacting and conductively connected to the counterpart terminal when the first contact portion is connected to the counterpart terminal, and a press-fitting portion that is press-fitted into the press-fitting hole; and a second terminal portion including a bent portion extending from the first terminal portion and bent around a bending axis along an axis line of the first terminal portion, and a second contact portion located at a position offset from the first contact portion in an intersecting direction intersecting the axis line of the first terminal portion and conductively connected to the conductor pattern when the boar mount connector is mounted on the circuit board.

A display device includes: a circuit substrate including a plurality of pixel circuit units and a plurality of pads on a first surface thereof, the plurality of pads being electrically connected to the pixel circuit units; a display substrate on the circuit substrate and including a plurality of light emitting elements electrically connected to the pixel circuit units; a circuit board on the circuit substrate and including a plurality of circuit board pads electrically connected to the pads; a heat dissipation substrate on a second surface of the circuit substrate, the second surface being opposite to the first surface; and a cover substrate on the heat dissipation substrate and partially overlapping the circuit substrate and the circuit board. Each of the plurality of pads is in direct contact with at least one of the plurality of circuit board pads.