An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

A pad arranging method and a pad arrangement structure for a wire bonding of a chip is provided. The method includes following steps. A soldered component and a circuit board are provided. A plurality of pads is arranged on the circuit board. a number of the pads is corresponding to a number of a plurality pins of the soldered component. The pads are disposed in a plurality of rows toward or away from the soldered component according to a predetermined arranging position, and the number of the pads on one of the rows at outer side is equal to that on one of the rows at inner side, or greater than that on one of the rows at inner side by one or more than one

A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.

A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

Two QSFP-DD transceivers' footprints are placed on the opposite sides of a PCB board. The two footprints are aligned in a special way and the connections among the pads of the two footprints are also specially defined. Based on that, the pads of the two footprints are connected through PCB traces and VIA. Two QSFP-DD electrical connectors are soldered onto the two footprints. So the high-speed signals from two QSFP-DD transceivers are directly connected in the shortest way when the two transceivers are plugged into the two QSFP-DD connectors.

An article for a power inverter, includes a multilayer printed circuit board having a first and second electrically conductive wiring layer and at least a first dielectric layer interposed between the first and second electrically conductive wiring layers. Each conductive wiring layer includes a common input and output line, the common input and output lines at least partially overlapping one another in a projection along a thickness of the multilayer printed circuit board. A set of input mounting pads is carried by the first common input line and a set of input mounting pads is carried by the second common input line, the input mounting pads of the second set of input mounting pads are interleaved with the input mounting pads of the first set of input mounting pads along a first axis. The article further includes a set output mounting pads carried by the common output line.

A printed circuit board includes: a base substrate including a unit region; a plurality of connection pads disposed on one surface of the base substrate; and first and second lead-in lines disposed on the one surface and respectively connected to at least a portion of the plurality of connection pads. The first and second lead-in lines have first and second cut surfaces on the one surface, respectively. The first cut surface is disposed in a position spaced apart from a side surface of the printed circuit board. The second cut surface is exposed to the side surface of the printed circuit board.

A circuit board electrically connected to an electronic device includes a base layer, a first conductive layer on a first surface of the base layer, a second conductive layer on a second surface of the base layer and including a terminal portion which is exposed outside of the circuit board and at which the circuit board is electrically connected to the electronic device, a first electromagnetic shield layer which faces the base layer with the first conductive layer therebetween and overlaps the terminal portion of the second conductive layer and a second electromagnetic shield layer which faces the base layer with the second conductive layer therebetween, and is spaced apart from the terminal portion of the second conductive layer in a direction along the base layer.