An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

A display device includes a display panel including first and second signal pads respectively disposed at one side and the other side of a center axis extending in a first direction and first and second fixing pads spaced apart from each other with the first and second signal pads interposed therebetween, and a flexible film including connection pads overlapping the signal pads and first and second alignment pads groups spaced apart from each other with the connection pads interposed therebetween. The first alignment pad group includes n first alignment pads arranged in the first direction, the second alignment pad group includes n second alignment pads corresponding to the first alignment pads, and a distance between corresponding first and second alignment pads decreases as a distance thereof from a display area decreases.

The present disclosure relates to a chip, a circuit board and an electronic device. The chip includes a chip substrate and a plurality of pads arrayed on the chip substrate. At least one of the plurality of pads on the chip is a polygonal pad.

A display apparatus having a display panel that includes a first pad portion is provided. A flexible printed circuit board is configured to attach to the display panel. The flexible printed circuit board includes a second pad portion that is configured to electrically connect to the first pad portion. The first pad portion includes a plurality of first signal pads, a first test pad, and a first alignment pad having a first shape. The second pad portion comprises a second alignment pad having a second shape. The second alignment pad includes a first portion and a second portion that are spaced apart from each other. The first shape and the second shape are configured to form a predetermined alignment mark when the flexible printed circuit board is attached to the display panel at a predetermined position.

A printed circuit board includes a circuit board body and a solder pad row disposed on a back of the circuit board body. The solder pad row includes a solder thief pad and a plurality of circular pin solder pads. An outline of an edge, on the solder thief pad proximate to the pin solder pads is an arc that is concave toward the solder thief pad.

A multi-gear brightness adjustment circuit board, and a multi-gear battery holder structure, which through adding the automatic control gear AUTO conductive contact piece and a light spot dot-circle pattern composite conductive contact piece on the circuit board, the gear can be automatically adjusted when the solar cell is used for power supply. Ensuring that the output light power meets the needs of ambient light, rationally use electric energy, which is conducive to energy saving; at the same time, the mode switching of the shooting target is integrated, which reduces the parts of the sight and makes the sight more compact.

The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.

The display panel includes: a plurality of first connection terminals, the first connection terminals being arranged into a first terminal row along a second direction, long edges of the first connection terminals being oriented along a first direction; and a plurality of second connection terminals, the second connection terminals being arranged into a second terminal row along the second direction, long edges of the second connection terminals being oriented along the second direction, the first terminal row and the second terminal row being arranged side by side along the first direction, the second direction not paralleling the first direction, the first connection terminals and the second connection terminals being connected respectively to different display rows or display columns within a display region of the display panel, and configured respectively to receive a drive signal driving display by the display panel.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A bonding pad structure includes a substrate, a flexible printed circuit board, and a plurality of bonding pins. The bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at a center of bonding pins. The at least two first bonding pins are located farthest away from the at least one central bonding pin and have mirror symmetry with respect to the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. A first width A of the first end and a second width B of the second end satisfy 0<A/B≤1. A tilt angle θ is formed between one of the at least two first bonding pins and one side of the substrate and satisfies 0<θ≤90.