A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.

A conductive terminal is adapted to electrically connect a wire to a circuit board. The circuit board has a through hole and solder pads on a surface of the circuit board. The conductive terminal comprises a base, a pair of mounting portions, and a pair of clamping portions. The base has a pair of opposing first edges, a pair of opposing second edges, and an insertion hole aligned with the through hole of the circuit board. The mounting portions include a pair of solder portions extending outwardly from the first edges and parallel to the base. The solder portions are each adapted to be soldered to one of the solder pads of the circuit board. The clamping portions extend obliquely toward each other from the two second edges of the base and are adapted to clamp a conductor of the wire inserted through the insertion hole and the through hole.

A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

The present invention provides an image capturing module and a portable electronic device. An image capturing module includes a circuit substrate, an image sensing chip, a filter element, and a lens assembly. The circuit substrate has an upper surface, a lower surface, and a through opening. The image sensing chip is placed on the lower surface of the circuit substrate and below the through opening. The filter element is placed on the upper surface of the circuit substrate and above the through opening. The lens assembly includes a holding structure and a lens structure. The lower surface of the circuit substrate includes a first solder area, a second solder area, and a first solderless area. The upper surface of the image sensing chip includes an image sensing area, a first conductive area, a second conductive area, and a first non-conductive area.

A display panel used for coupling to another display panel in a side by side manner is disclosed, which includes: a first substrate, including a first hole, a first surface and a second surface opposite to the first surface; a first conductive layer disposed on the first surface of the first substrate; a first circuit layer disposed on the second surface of the first substrate; a first connecting element disposed in the first hole and connecting the first conductive layer and the first circuit layer; and a first sealing layer disposed on the first conductive layer, wherein the first hole at least partially overlaps the first sealing layer. In addition, a display device comprising two display panels disposed adjacent to each other is also disclosed.

A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.

According to one embodiment, an electronic device includes a wall and a substrate. The substrate is provided with an opening. The substrate includes an organic compound layer, a first surface of the organic compound layer, a second surface of the organic compound layer opposite the first surface, first wiring on the second surface, second wiring on the second surface, a first pad, and a second pad. The first surface is attached to the wall. The first pad is connected to the first wiring. The second pad is connected to the second wiring away from the first pad. The opening penetrates the organic compound layer to open to the first surface and the second surface between the first pad and the second pad.

A circuit board according to an embodiment includes: a substrate including one surface and the other surface; a first circuit pattern disposed on the one surface; and a second circuit pattern disposed on the other surface, wherein at least one via is formed in the substrate, and the first circuit pattern and the second circuit pattern are wire-bonded through the via to conduct electricity.

A wiring module according to an embodiment of the present technology includes: a wiring board and a heat dissipation member. The wiring board includes a body portion and one or more heat dissipation vias, the body portion including a front surface layer to which a device package is connected and a rear surface layer opposite to the front surface layer, the one or more heat dissipation vias penetrating the body portion from the front surface layer to the rear surface layer. The heat dissipation member is connected to the rear surface layer so as to thermally bond with the one or more heat dissipation vias.

A display panel used for coupling to another display panel in a side by side manner is disclosed, which includes: a first substrate, including a first hole, a first surface and a second surface opposite to the first surface; a first conductive layer disposed on the first surface of the first substrate; a first circuit layer disposed on the second surface of the first substrate; a first connecting element disposed in the first hole and connecting the first conductive layer and the first circuit layer; and a first sealing layer disposed on the first conductive layer, wherein the first hole at least partially overlaps the first sealing layer. In addition, a display device comprising two display panels disposed adjacent to each other is also disclosed.