According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.

A component carrier with an electrically insulating layer having a front side and a back side, a first and a second electrically conductive layer covering the front side and the back side of the electrically insulating layer, respectively. A through hole extends through both electrically conductive layers and the electrically insulating layer. An overhang is formed along one of the electrically conductive layers and sidewalls of the electrically insulating layer structure delimiting the through hole. An annular plating layer covers the sidewalls and fills part of the overhang such that a horizontal extension of the overhang after plating is less than 20 μm and/or such that a ratio between a horizontal extension of the overhang after plating and a width of a first window through the first electrically conductive layer and/or a width of a second window through the second electrically conductive layer is smaller than 20%.

A component carrier with an electrically insulating layer having a front side and a back side, a first and a second electrically conductive layer covering the front side and the back side of the electrically insulating layer, respectively. A through hole extends through both electrically conductive layers and the electrically insulating layer. An overhang is formed along one of the electrically conductive layers and sidewalls of the electrically insulating layer structure delimiting the through hole. An annular plating layer covers the sidewalls and fills part of the overhang such that a horizontal extension of the overhang after plating is less than 20 μm and/or such that a ratio between a horizontal extension of the overhang after plating and a width of a first window through the first electrically conductive layer and/or a width of a second window through the second electrically conductive layer is smaller than 20%.

A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole.

An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.

This application provides a multilayer printed circuit board (PCB). There is a pad array on a surface of the multilayer PCB. The pad array includes at least one padding unit, and each padding unit includes a first pad and a second pad that are adjacent. Both the first pad and the second pad are connected to a first Z-directed transmission line located in a Z-directed groove. In this way, to wire a signal wire on a signal layer of the multilayer PCB, a quantity of Z-directed grooves that need to be bypassed is less than a quantity of vias that need to be bypassed in the prior art. In other words, wiring of the signal wire is easier to some extent. In addition, this application further provides a corresponding communications device.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A printed circuit board according to one aspect of the present invention includes an insulating layer having a through-hole, a conductive layer laminated on an inner circumferential surface of the through-hole, and metal plating layers laminated on a surface of the conductive layer facing opposite the insulating layer and laminated on both surfaces of the insulating layer, wherein an average thickness of the insulating layer is greater than or equal to 5 m and less than or equal to 50 m, wherein an average thickness of the metal plating layers is greater than or equal to 3 m and less than or equal to 50 m, wherein a hole diameter of the through-hole gradually increases from a first end of the through-hole at one surface of the insulating layer to a second end of the through-hole at another surface of the insulating layer, wherein the hole diameter of the through-hole at the first end is greater than or equal to 1.5 times, and less than or equal to 2.5 times, the average thickness of the metal plating layers, and wherein the hole diameter of the through-hole at the second end is greater than or equal to 1.1 times, and less than or equal to 2 times, the hole diameter of the through-hole at the first end thereof.

A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 m or greater and 35 m or less at the first surface, and is 3 m or greater and 15 m or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 m or greater and 12 m or less.