A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.

A wiring substrate includes an insulating layer having through holes, a first conductor layer formed on first surface of the insulating layer, a second conductor layer formed on second surface of the insulting layer on the opposite side, and interlayer connection conductors formed in the through holes through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the though holes include first and second groups of through holes and that the through holes in the second group have inner walls covered with non-conductive resin, and the interlayer conductors includes first interlayer conductors each including a plating film formed in the first group of through holes, and second interlayer conductors each including a plating film formed in the second group of through holes such that minimum distance between the second interlayer conductors is smaller than minimum distance between the first interlayer conductors.

A wiring substrate includes an insulating layer having through holes, a first conductor layer formed on first surface of the insulating layer, a second conductor layer formed on second surface of the insulting layer on the opposite side, and interlayer connection conductors formed in the through holes through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the though holes include first and second groups of through holes and that the through holes in the second group have inner walls covered with non-conductive resin, and the interlayer conductors includes first interlayer conductors each including a plating film formed in the first group of through holes, and second interlayer conductors each including a plating film formed in the second group of through holes such that minimum distance between the second interlayer conductors is smaller than minimum distance between the first interlayer conductors.

In a non-reciprocal circuit element, a permanent magnet is connected to one main surface of a magnetic plate, and a circuit board is connected to the other main surface of the magnetic plate, with a solder bump lying between the circuit board and the other main surface. The permanent magnet can control the transmission of electrical signal from each of a plurality of signal conductors of circuit board to a corresponding one of a plurality of input/output terminals of the magnetic plate. The non-reciprocal circuit element further includes an underfill material arranged between the magnetic plate and the circuit board. The magnetic plate has a through hole formed therein, the through hole extending from one main surface to the other main surface. The through hole has an empty space in which at least a part of a conductive film arranged in the through hole is exposed.

A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

A glass wiring board in which a glass substrate with a small thickness is used as a core substrate to prevent glass breakage during manufacture, and an analog splitter composed of a capacitor and an inductor is formed on the glass substrate so as to stabilize the electrical properties of the analog splitter. An inductor is formed using a through electrode which is in contact with an inorganic adhesive layer on a glass substrate on which the inorganic adhesive layer is formed. A capacitor is formed using an insulating resin opening part formed in an insulating resin layer covering the glass substrate having wiring. The inductor and the capacitor are formed on different layers.