Provided is a substrate including a first wiring layer, wherein the first wiring layer has a structure in which among a plurality of first connection parts of a plurality of vias, at least one of first connection parts of two vias located closer to both ends of the first wiring layer is coupled to a body of the first wiring layer through a first conductive portion, each of the plurality of first connection parts being coupled to the first wiring layer, and a cross-sectional area of the first conductive portion is less than an area of a first part of the first wiring layer, the first part being in contact with a first connection part of a via other than the first connection parts of the two vias.

The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.

Provided is a printed wiring board including: a plurality of inner layers including a ground layer and a power supply layer; and a plurality of ground vias and a plurality of power supply vias each provided to penetrate at least the ground layer and the power supply layer in a thickness direction of the printed wiring board, a ground potential being applied to the plurality of ground vias at the ground layer, and a power supply potential being applied to the plurality of power supply vias at the power supply layer. In a top view from a direction perpendicular to the printed wiring board, a distance between vias to which the same potential is applied is shorter than a distance between vias to which different potentials are applied.

A multilayer circuit board includes a plurality of wiring layers laminated with insulation layers interposed therebetween, the multilayer circuit board further including a solder resist layer that covers a front face wiring layer formed on a front face side insulation layer, in which the front face wiring layer includes a pad for leg terminal to which a leg terminal of a connector is connected, the solder resist layer has an opening part for leg terminal which exposes a part of the pad for leg terminal, a via for leg terminal is provided beneath the pad for leg terminal in a predetermined range straddling a contour line of an opening part for leg terminal, and the via for leg terminal connects a first internal wiring layer with the pad for leg terminal.

A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.

A wiring board assembly (1) includes: a flexible printed wiring board (2) which includes at least an insulating substrate (5) including a through-hole (53), and wiring patterns (61) and (62) provided on the insulating substrate (5) and extending to peripheral edge portions (531n) and (532n) of the through-hole (53); a metal reinforcing plate (3) attached to the flexible printed wiring board (2) and facing the through-hole (53); and a solder connection portion (4) covering an inner wall surface (534) of the through-hole (53) and electrically connecting the wiring patterns (61) and (62) to the metal reinforcing plate (3).

Signal transmission characteristics in a case where a conductive pin is inserted into a through hole to perform connection with an external circuit are improved. A multilayer wiring substrate includes a front layer and a rear layer, and includes a plurality of layers in an inner layer. A conductive portion is provided in each of the layers, and a wiring is disposed on the rear layer. The conductive pin for connection with the external circuit is inserted into the through hole. A land is disposed around the through hole on the rear layer, and the land and the conductive pin are connected to each other through solder.

A substrate for mounting a light-emitting element includes a substrate that is composed of a ceramic(s), a terminal for an element that is provided on a front surface of the substrate where a light-emitting element is mounted thereon, a terminal for a power source that is provided on the substrate where an external power source is connected thereto, and a wiring part that is provided inside the substrate and electrically connects the terminal for an element and the terminal for a power source. Furthermore, the wiring part includes a first conductor that extends in a surface direction of the substrate and a second conductor that extends substantially parallel to the first conductor on an opposite side of the front surface and is connected in parallel with the first conductor.

In one embodiment, an apparatus includes a plurality of layers in a printed circuit board comprising at least one power plane and at least one ground plane, and a plurality of vias extending through the plurality of layers and connecting two or more of the layers, the plurality of vias comprising at least one pair of differential signal vias and at least one pair of power vias, the signal vias and power vias surrounded by a plurality of ground vias. The ground plane includes an anti-pad formed therein by an opening defined by removal of material, with the pair of differential signal vias and pair of power vias extending through the anti-pad in the ground plane to reduce power via resonance.

In one embodiment, an apparatus includes a plurality of layers in a printed circuit board comprising at least one power plane and at least one ground plane, and a plurality of vias extending through the plurality of layers and connecting two or more of the layers, the plurality of vias comprising at least one pair of differential signal vias and at least one pair of power vias, the signal vias and power vias surrounded by a plurality of ground vias. The ground plane includes an anti-pad formed therein by an opening defined by removal of material, with the pair of differential signal vias and pair of power vias extending through the anti-pad in the ground plane to reduce power via resonance.