A printed wiring board includes a first main wire having first inner layer wiring patterns which are wired on inner layers connected by first via conductors in series. In addition, a second main wire has second inner layer wiring patterns which are wired on the inner layers connected by second via conductors. The first inner layer wiring patterns and the second inner layer wiring patterns are wired so as to change the layer to the inner layer on the opposite side to each other. First and second branch wires are branched from the first and second via conductors, respectively.

A flexible circuit board includes at least one continuous wire where first and second partial wires and second partial wires respectively formed on first and second main surfaces of a strip-shaped insulating sheet are connected alternately via vias and which includes first and second continuous portions that cross in a chain-like shape to form annular portions without electrical continuity to each other in a projection plan view seen in a normal direction of a main surface of the insulating sheet. Two ends of each first and second partial wires are respectively placed along two long sides of the insulating sheet. Each via is placed on a connection conductor portion that extends from each of ends of the first partial wires and ends of the second partial wires that overlap with the insulating sheet interposed therebetween toward a closer long side of the two long sides.

A wiring substrate includes a first insulation layer, a first wiring layer formed on the first insulation layer, and a second insulation layer stacked on the first insulation layer. The second insulation layer covers the first insulation layer and includes a filler. A third insulation layer is stacked on the second insulation layer. The third insulation layer is filler-free. A through electrode extends through the second and third insulation layers in a thicknesswise direction. A second wiring layer is stacked on the third insulation layer and the through electrode. The through electrode electrically connects the second wiring layer to the first wiring layer.

A pitch conversion module includes a plurality of double-sided substrates including a first metal pattern formed on an upper surface, a second metal pattern formed on a lower surface, and a metal via connecting the first metal pattern and the second metal pattern, and a first conductive paste via formed of conductive paste connecting the first metal pattern and the second metal pattern between the double-sided substrates adjacent to each other in a double-sided substrate block in which a plurality of the double-sided substrates are stacked.

An electronic device includes: a multilayered base substrate including a plurality of substrate bases stacked on each other; a first conductive via and a second conductive via penetrating the substrate bases and spaced from each other; a conductive line electrically connecting the first conductive via and the second conductive via to each other and disposed on at least one of the substrate bases of the plurality of substrate bases; and an open stub including a first end and a second end, wherein the first end is connected to a connector of the conductive line, and the second end is opened.

Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.

An inductor, a circuit board and a method for forming an inductor are provided. The inductor comprises: a first pad arranged on a first metal wiring layer of a circuit board; a second pad arranged on a second metal wiring layer of the circuit board; and a first hole with conducting medium filled therein, one end of the first hole being located in the first pad and the other end thereof being located in the second pad. The inductor can effectively reduce the area of the circuit occupied by the inductor.

A circuit board for a communication connector, comprising a first signal input terminal, a first signal output terminal, a second signal input terminal, a second signal output terminal, a first signal wire, a second signal wire, a capacitive structure and a capacitive cylinder. The first signal input terminal and the first signal output terminal are coupled by the first signal wire; the second signal input terminal and the second signal output terminal are coupled by the second signal wire; the capacitive structure is coupled with the first signal wire; the capacitive cylinder is coupled with second signal wire. The capacitive structure and the capacitive cylinder are capacitive coupled between the first signal wire and the second signal wire.

A parallel via design is disclosed to improve the impedance match for embedded common mode choke filter designs. Particularly suited to such designs on four-layer printed circuit boards, the parallel via design effectively suppresses the reflection of the differential pair. By connecting the vias in parallel, the inductance of the entire via structure is reduced while its capacitance is simultaneously increased. By properly choosing the number of parallel vias and the spacing between them, the impedance of the parallel vias can be well controlled within the frequency range of interest. Consequently, the impedance match can be improved and the return loss of a four-layer printed circuit board common mode choke filter design is reduced.

A semiconductor device includes a semiconductor chip, a plurality of external terminals, and a board. The board includes a first main surface in which a plurality of first electrodes electrically connected to the semiconductor chip are formed, a second main surface in which a plurality of second electrodes electrically connected to the plurality of external terminals are formed, and a plurality of interconnect layers, provided between the first main surface and the second main surface, for forming a plurality of signal paths that electrically connect the first electrode and the second electrode corresponding thereto. The interconnect layer includes a plurality of metal members which are dispersedly disposed at a distance shorter than an electromagnetic wavelength equivalent to a signal band of a signal supplied to the signal path, in the vicinity of a portion in which a structure of an interconnect for forming the signal path is changed.