A three-dimensional printed wiring board includes a main substrate and a standing substrate. First electrodes on the main substrate and second electrodes on the standing substrate are joined with solder. The main substrate includes a first main surface having a slit. The standing substrate includes a second main surface and includes a support portion inserted in the slit. Each of the slit and the support portion is divided into a plurality of parts with respect to the extending direction. A restraint point at which the slit and the standing substrate are in contact with each other is located on any of end portions of a pair of slits adjacent to each other among a row of a plurality of slits arranged in the extending direction.

Printed circuit boards having an increased density of vertical interconnect paths, as well as methods for their manufacture. One example may provide a printed circuit board having an increased density of vertical interconnect paths by forming a plurality of segmented vias. The segmented vias may extend through interior layers of the printed circuit board. The segmented vias may be formed of portions of vias in the interior layers of the printed circuit board. An area between three or more segmented vias may be filled with resin or other material or materials.

An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.

A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.

Provided is a substrate including a first wiring layer, wherein the first wiring layer has a structure in which among a plurality of first connection parts of a plurality of vias, at least one of first connection parts of two vias located closer to both ends of the first wiring layer is coupled to a body of the first wiring layer through a first conductive portion, each of the plurality of first connection parts being coupled to the first wiring layer, and a cross-sectional area of the first conductive portion is less than an area of a first part of the first wiring layer, the first part being in contact with a first connection part of a via other than the first connection parts of the two vias.

A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

A multilayer structure for a printed wiring board (PWB) includes a plurality of insulating layers interleaved with a plurality of conductive layers including one or more inner conductive layers, a top conductive layer, and a bottom conductive layer. The multilayer structure also includes at least one through-hole through the plurality of insulating layers and the plurality of conductive layers. The multilayer structure also includes at least one secondary material layer formed on at least one inner conductive trace or a terminating land having a surface and an edge near one of the at least one through-hole, the at least one secondary material layer after being removed partially defining a recess that allows plating on both the edge and the surface of the at least one inner conductive trace or the terminating land. The at least one through-hole includes a first plated segment seamless connected to a second plated segment wrapped over the edge of the at least one inner conductive trace or terminating land and extending at least a portion of the surface of the at least one inner conductive trace or terminating land.

A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.

A method and structure that forms a PCB while removing or eliminating a stub from a via without back-drilling or doing multi-laminations. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. The via includes a plated through hole that is connected to at least two other metalized layers. There is a portion of the via that is extraneous and that has a negative performance on the functionality of the printed circuit board. The single lamination buried via method adds a seed layer resist that prevents an electrical connection during electroplating thus preventing the via from metalizing where it is not desired.