According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the adhesion layer covers the coating layer, an area of the metal material per unit area is smaller than that of the other area of the terminal.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

A light-emitting module includes (i) a board provided with: a circuit pattern and a plurality of bottomed holes in each of a set of wiring pads continuous with the circuit pattern on a first surface; electrically conductive paste extending over two or more of the bottomed holes; and an insulating resin covering the electrically conductive paste at a side close to the first surface, and (ii) a plurality of light-emitting segments connected to a second surface of the board with an adhesive sheet interposed therebetween. The light-emitting segments each include a plurality of light-emitting devices that are aligned. The electrically conductive paste includes a portion disposed on a portion of a surface of the wiring pad extending over two or more of the bottomed holes.

A strain gauge includes a flexible substrate, a resistor, and electrodes. Each electrode includes first patterns juxtaposed at predetermined intervals and electrically connected to each other. Second patterns of which longitudinal directions are toward a same direction as a longitudinal direction of each of the first patterns are disposed between opposing electrodes. The second patterns are electrically floating dummy patterns. The second patterns of which the longitudinal directions are toward a same direction as the longitudinal direction of each first pattern are disposed, the second patterns being interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode. The plurality of second patterns are interposed between first patterns opposite each other that are among given first patterns that constitute one of the electrodes and given first patterns that constitute another electrode.

An electronic card comprising: a first card portion including lightning protection components, a first ground plane and a first ground zone; a second card portion comprising functional components, a second ground plane and a second ground zone; a third card portion, which separates and electrically isolates the first ground plane and the first ground zone from the second ground plane and from the second ground zone; the first ground zone and the second ground zone being unvarnished; the first ground zone and the second ground zone being arranged in order to be applied onto a housing element that is electrically conductive and that belongs to a housing in which the electronic card is integrated.

An anti-interference circuit board and a terminal are provided. The circuit board specifically includes a substrate (10). The substrate (10) has a first surface, and a first region (14) for placing a magnetometer (2) is disposed on the first surface. A plurality of circuit layers (11, 12, 15) are disposed in the substrate (10), and the plurality of circuit layers (11, 12, 15) are disposed in a stacked manner. For example, at least a first functional circuit (20) that is configured to generate a magnetic field in a first direction and a second functional circuit (30) that is configured to generate a magnetic field in a second direction are disposed in a stacked manner and are disposed in the substrate (10). When positions of the first functional circuit (20) and the second functional circuit (30) are specifically disposed, the following is met: the first region (14) is located in vertical projections of the first functional circuit (20) and the second functional circuit (30) on the first surface. It can be learned from the foregoing descriptions that the first functional circuit (20) and the second functional circuit (30) are disposed to compensate for interference to the magnetometer (2) in the first region (14), and during disposing, the first functional circuit (20) and the second functional circuit (30) are located below the magnetometer (2), to reduce an occupied surface area of the anti-interference circuit board.

A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

A circuit board is a circuit board on which a predetermined circuit unit that causes heat and electromagnetic noise is disposed, and which is to be fixed to a conductive housing with a conductive screw. The circuit board includes: an insulator layer including an insulating plate-shaped base material; a conductor layer having a circuit pattern including a ground portion, which is disposed on at least one surface of the insulator layer; and a screw insertion hole that penetrates the insulator layer and the ground portion, and through which the conductive screw is to be inserted. The ground portion has a slit disposed between the screw insertion hole and the predetermined circuit unit. The ground portion has a ground bridge that electrically connects a portion of the ground portion between the slit and the screw insertion hole and a portion of the ground portion between the slit and the predetermined circuit unit.

A method may include receiving a first and a second complementary signal to provide differential signaling. The method may further include providing a first conductor trace to transport the first complementary signal; providing a second conductor trace to transport the second complementary signal, the second conductor trace immediately adjacent to the first conductor trace; providing a third conductor trace to transport the first complementary signal, the third conductor trace immediately adjacent to the second conductor trace; and providing a fourth conductor trace to transport the second complementary signal, the fourth conductor trace immediately adjacent to the third conductor trace.

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.