A transmission line member includes a base body extending along a transmission direction of a high-frequency signal, and a first transmission line, a second transmission line, and a third transmission line. The base body includes a first portion including the first transmission line, a second portion including the second transmission line, and a third portion including the third transmission line. The second portion is connected between the first and third portions. A thickness of the second portion is smaller than a thickness of the first and third portions. The second transmission line includes only a conductor pattern extending more in the transmission direction than in a direction of the thickness.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

A strain gauge includes a flexible substrate, a resistor formed of material containing at least one from among chromium and nickel, on or above the substrate, and a pair of electrodes electrically connected to the resistor. Each electrode includes a plurality of first patterns that are juxtaposed at predetermined intervals and that are electrically connected to each other. A plurality of second patterns of which longitudinal directions are toward a same direction as a longitudinal direction of each of the first patterns are disposed between opposing electrodes.

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

The present disclosure describes expansion card interfaces for a printed circuit board and methods of making the same. The methods include forming electrical pads of the expansion card interface on a substrate, and dividing at least one electrical pad into a first portion and a second portion. The resulting expansion card interfaces have the first portion conductively coupled to a circuit on the printed circuit board, and the second portion conductively isolated from the first portion.

The invention relates to an electronic board (1) comprising: a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).

Disclosed is an electronic apparatus including a substrate (20) and a connector (10) disposed on one edge constituting an outer periphery of the substrate (20). A slit (21) is formed in the substrate (20), with a starting point being a position between an end point on one side of the edge and the position where the connector (10) is disposed.

An electronic device including: a discrete transistor including a semiconductor chip encapsulated in a package made of an insulating material leaving access to a first pad of connection to a first conduction terminal of the transistor; and a printed circuit board (320) including first (125) and second (129) separate connection pads, wherein the transistor is assembled on the printed circuit board so that the first connection pad (105) of the transistor is in contact with the first (125) and second (129) connection pads of the printed circuit board.

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Provided is a key structure including a base plate having at least one connecting seat and at least one notch adjacent to a lower portion of the connecting seat; a keycap disposed above the base plate in a liftable manner; a thin film circuit assembly disposed on the base plate and located between the base plate and the keycap; and a supporting rod connected to the keycap and the base plate and located between the thin film circuit assembly and the keycap. An accommodating space formed by the notch extends from and communicates with a through hole of the connecting seat. The connecting seat protrudes out from an opening of the thin film circuit assembly. A vertical projection region of the notch on the base plate is located within a vertical projection region of the opening on the base plate. The invention also provides a keyboard module.