An electrode embedded member includes a plate-shaped substrate having a front surface and a back surface and that is made of a ceramic, an inner electrode extending parallel to the front surface of the substrate and that is embedded in the substrate, a connection member extending parallel to the front surface of the substrate and that is disposed so as to overlap the inner electrode, and a terminal connected to the connection member. The electrode embedded member has a predetermined structure including at least one of the following: a first predetermined structure in which a thickness of at least a part of the connection member in a direction perpendicular to the front surface of the substrate is 0.2 mm or smaller; a second predetermined structure in which the connection member includes a cutout portion; and a third predetermined structure in which the connection member is composed of a mesh structure.

A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

The present disclosure includes an electronic device including a wiring structure, the wiring structure includes a first wiring pattern including a plurality of first input wires and a plurality of first output wires, a second wiring pattern including a plurality of second bridge wires, one second bridge wiring crosses at least one of the plurality of first input wires or at least one of the plurality of first output wires, and a first insulating layer disposed between the first wiring pattern and the second wiring pattern, the plurality of first input wires are electrically connected to the first output wires through the second bridge wires.

A method for manufacturing a touch panel includes the steps of: forming a first imprint layer; forming a first wire forming groove portion; forming a first wire; forming a spacer layer so that the spacer layer is placed over a surface of the first imprint layer in which the first wire forming groove portion has been formed and overlaps a part of the first wire; forming a second imprint layer so that the spacer layer is sandwiched between the first imprint layer and the second imprint layer; forming a second wire forming groove portion; forming a second wire; and delaminating the spacer layer from the first imprint layer and removing, together with the delaminated portion, a portion of the second imprint layer that overlaps the delaminated portion.

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer. Conductive traces are arranged in the flexible first layer and coupled to a first circuit block at a first end of the flexible PCB and coupled to a second circuit block at a second end of the flexible PCB such that the first circuit block is coupled to the second circuit block through the conductive traces. Companion traces re arranged in the flexible second layer to provide a reference plane coupled to the first and second circuit blocks. The companion traces are arranged in the flexible second layer to be replicas of the conductive traces such that each one of the conductive traces is proximate to and aligned with a corresponding one of the companion traces along an entire length between the first and second circuit blocks.

An example printed circuit board includes a ground plane having a fusible region and a power plane. The power plane is isolated from the ground plane by an insulating layer. At least one circuit component is mounted to the ground plane and is positioned within the fusible region of the printed circuit board.

A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.