A backlight bar includes a flexible circuit board and backlight lamp, the flexible circuit board includes a circuit board base and an electrostatic shielding structure, the electrostatic shielding structure is disposed on a first surface of the circuit board base and located in a non-marginal region, and the backlight lamp disposed on a second surface of the circuit board base, the first surface disposed opposite to the second surface. A backlight module and a display device are also provided.

A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.

A wiring substrate includes: a plurality of wiring layers; and a plurality of insulating layers. The wiring substrate includes: a mounting region on which an electronic component is to be mounted; and a non-mounting region on which no electronic component is to be mounted and which is configured to be bent in a first direction. At least one of the wiring layers comprises a shield pattern. The shield pattern disposed in the non-mounting region is defined by a plurality of through holes arranged at predetermined intervals. Each of the through holes has a bent portion bent in plan view.

Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.

A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

An electronic package can include modulated mesh planes for reducing crosstalk between adjacent signal wires within the electronic package. Modulated mesh planes above and below a wiring plane can include sets of adjacent wires arranged in an orientation parallel to signal wires within the wiring plane, and sets of adjacent wires arranged in an orientation perpendicular to the signal wires. The sets of wires in each of the mesh planes are each electrically interconnected and insulated by a dielectric layer from the signal wires. The electronic package also includes a region of the mesh planes having the adjacent wires that are arranged in an orientation perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

A conductive member 1 for a touch panel includes a plurality of first electrodes 11 extending in a first direction and arranged in parallel in a second direction intersecting the first direction, in which the plurality of first electrodes are constituted by a first mesh conductive film MF1 constituted by a plurality of fine metal wires Ma, and include a plurality of first main electrodes each having a defined electrode width Wa and at least one first sub-electrode having an electrode width Wb smaller than the electrode width Wa of the first main electrode, and in which over an entire region of the first sub-electrode, a mesh pitch Pb of the first mesh conductive film MF1 constituting the first sub-electrode in the second direction is smaller than a mesh pitch Pa of the first mesh conductive film MF1 constituting the first main electrode in the second direction.

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.