A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.

A conductive member 1 for a touch panel includes a plurality of first electrodes 11 extending in a first direction and arranged in parallel in a second direction intersecting the first direction, in which the plurality of first electrodes are constituted by a first mesh conductive film MF1 constituted by a plurality of fine metal wires Ma, and include a plurality of first main electrodes each having a defined electrode width Wa and at least one first sub-electrode having an electrode width Wb smaller than the electrode width Wa of the first main electrode, and in which over an entire region of the first sub-electrode, a mesh pitch Pb of the first mesh conductive film MF1 constituting the first sub-electrode in the second direction is smaller than a mesh pitch Pa of the first mesh conductive film MF1 constituting the first main electrode in the second direction.

A mask including a substrate and a mesh pattern are disclosed along with an electronic device. The mesh pattern, being disposed on the substrate, includes a first striped pattern and a second striped pattern; the first striped pattern includes a first, second, and third section, and the second section is disposed between the first and the third sections; the second striped pattern includes a fourth, fifth, and sixth section, and the fifth section is disposed between the fourth and the sixth sections; the first section has a first extension direction, the fourth section has a second extension direction, and a first included angle is between the first extension direction and the second extension direction; the fifth section and the second section intersect each other while having a second included angle between the two sections, and the second included angle is greater than the first included angle.

An object of the present invention is to provide a method for forming a conductive thin wire, the method being capable of improving thin wire formability, conductivity, adhesion, and transmittance of a conductive thin wire, a method for producing a transparent conductor, a method for producing a device, and a set of a conductive ink and a base material. This object is achieved by a method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, in which the base material has surface energy of less than 40 mN/m, and conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2≤θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2.

An electronic apparatus which achieves ease of incorporating flexible boards into the electronic apparatus and ease of impedance control at the same time. A first flexible board and a second flexible board are placed along a structure having a bent portion and a flat portion. Differential signal wires are wired on one surface of the first flexible board placed between the structure and the second flexible board, and first ground wires for impedance control of the differential signal wires are wired on the other surface and on a rear side of the differential signal wires. Second ground wires for impedance control of the differential signal wires are wired on one surface of the second flexible board the one surface of the first flexible board faces. A wiring density of the first and second ground wires differs between an area along the bent portion and an area along the flat portion.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.

The disclosure relates to methods for direct ink jet printing of printed circuits' infrastructure. Specifically, the disclosure relates to methods for direct inkjet printing of heatdissipation elements and sockets for use in printed circuit boards (PCBs), flexible printed circuits (FPCs) and high-density interconnect (HDI) printed circuits.

This disclosure provides a stretchable conductor structure, a garment with a stretchable conductor structure, and a method for producing a stretchable conductor structure. The conductive structure includes a set of conductive wires and a stretchable laminate. The set of conductive wires, each including a protective surface, the set of conductive wires patterned in a mesh structure to accommodate a manipulation while providing electrical conductivity across the set of conductive wires. The stretchable laminate encapsulates the mesh structure, the stretchable laminate can return the mesh structure of the set of conductive wires to an original state after the manipulation.