A glass wiring board is provided with an analog duplexer including an inductor and a capacitor, and includes: a core wiring board provided with the coil-shaped inductor having through electrodes and wiring patterns provided in a glass substrate via an inorganic adhesive layer, and with a land pattern connected to an outer layer; the capacitor having a structure with a dielectric layer sandwiched between upper and lower electrode patterns on an insulating resin layer covering the core wiring board; and a wiring pattern for connecting to an external component such as an external substrate.

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.

An article for a power inverter, includes a multilayer printed circuit board having a first and second electrically conductive wiring layer and at least a first dielectric layer interposed between the first and second electrically conductive wiring layers. Each conductive wiring layer includes a common input and output line, the common input and output lines at least partially overlapping one another in a projection along a thickness of the multilayer printed circuit board. A set of input mounting pads is carried by the first common input line and a set of input mounting pads is carried by the second common input line, the input mounting pads of the second set of input mounting pads are interleaved with the input mounting pads of the first set of input mounting pads along a first axis. The article further includes a set output mounting pads carried by the common output line.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A wiring substrate includes an insulating substrate that is square in plan view, the insulating substrate having one main surface with a recess and an other main surface opposite to the one main surface, and external electrodes located on the other main surface of the insulating substrate and in a peripheral section of the insulating substrate. The external electrodes include first external electrodes and second external electrodes. In plan view, the first external electrodes are located at corners of the insulating substrate, and the second external electrodes are interposed between the first external electrodes. Each of the first external electrodes has a smaller area and a larger width in a direction orthogonal to each side of the insulating substrate than each of the second external electrodes.

A light emitting device filament includes a substrate having a first surface and a second surface opposite to the first surface and extending in one direction, at least one light emitting device chip disposed on the first surface, and an auxiliary pattern disposed on the second surface and disposed at a position corresponding to the light emitting device chip.

According to various embodiments, a printed circuit board may include: a first wiring layer including at least one first signal line and at least one first dummy line; and a second wiring layer arranged on the first wiring layer and including at least one second signal line and at least one second dummy line, wherein when the printed circuit board is viewed from above, the at least one first signal line may be arranged to overlap, at least in part, the at least one second dummy line, and the at least one second signal line may be arranged to overlap, at least in part, the at least one first dummy line.

A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.

Provided are a wire for use in an extendable electronic device, an extendable electronic device and preparation methods thereof. The wire is provided with a hollow region allowing extension and deformation of the wire.

A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.