A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.

A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.

An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

Disclosed herein are printed circuit boards with embedded solenoid filters through which signal traces pass to filter unwanted noise and electromagnetic interference. A printed circuit board comprises a least three layers, a solenoid embedded within the at least three layers, and at least one trace extending through the solenoid. The insertion loss characteristics of the solenoid filter can be tuned by modifying the number of turns in the solenoid(s) and the width of the solenoid(s). The solenoid filter may comprise multiple solenoids connected in series, with adjacent solenoids having opposite wind directions. Surface components may be included on the board to tune the insertion loss further.

Antenna module substrate employing vertical conductor loops for coupling noise reduction in radio-frequency (RF) transmission lines, and related antenna modules and fabrication methods. To provide effective electrical isolation between closely routed RF transmission lines in a metallization layer of the substrate, vertical conductor loops are formed in a metallization layer(s) adjacent to the RF transmission lines. The magnetic flux loop generated by the RF transmission lines as a result of carrying RF signals penetrates through the opening of the adjacent vertical loop structures, thereby inducing a magnetic field in the vertical conductor loops in the opposite direction of the magnetic flux. The induced magnetic field in the vertical conductor loops induces eddy currents in the vertical conductor loops, which in turn interferes with the magnetic flux thus causing a magnetic damping force in the magnetic flux, thus reducing or cancelling RF transmission line coupling noise.

In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

In an illustrative example, an apparatus includes a passive-on-glass (POG) device integrated within a glass substrate. The apparatus further includes a semiconductor die integrated within the glass substrate.

An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

The terminal connection structure includes a first terminal group 80 including a plurality of first terminals 81 aligned side-by-side, and a second terminal group 110 including a plurality of second terminals 112 aligned side-by-side and connected to the plurality of first terminals 81, the second terminal group 110 opposing to the first terminal group 80 and electrically connected to the first terminal group 80 via an anisotropic conductive film, wherein each of the first terminals 81 has a recess-projection shape and each of the second terminals 112 has a recess-projection shape, two adjacent first terminals 81A, 81B have different and corresponding shapes with each other, and two adjacent second terminals 112A, 112B have different and corresponding shapes with each other.