H05K2201/09709

THREE-DIMENSIONAL INDUCTOR STRUCTURE AND STACKED SEMICONDUCTOR DEVICE INCLUDING THE SAME

A three-dimensional (3D) inductor structure comprising: a first semiconductor die including: a first conductive pattern; and a second conductive pattern spaced apart from the first conductive pattern; a second semiconductor die stacked on the first semiconductor die, the second semiconductor die including: a third conductive pattern; a fourth conductive pattern spaced apart from the third conductive pattern; a first through-substrate via (TSV) penetrating the second semiconductor die and electrically connecting the first conductive pattern with the third conductive pattern; and a second TSV penetrating the second semiconductor die and electrically connecting the second conductive pattern with the fourth conductive pattern, and a first conductive connection pattern included in the first semiconductor die and electrically connecting a first end of the first conductive pattern with a first end of the second conductive pattern, or included in the second semiconductor die and electrically connecting a first end of the third conductive pattern with a first end of the fourth conductive pattern.

Display apparatus

A display apparatus includes a flexible circuit board including a plurality of first substrate pads and a plurality of second substrate pads, a main circuit board connected to the flexible circuit board, and a display panel including a plurality of first display pads and a plurality of second display pads, where the plurality of first display pads is connected to the main circuit board through the flexible circuit board and each of the plurality of first display pads at least partially overlaps corresponding substrate pad of the plurality of first substrate pads, respectively, and each of the plurality of second display pads at least partially overlaps corresponding substrate pad of the plurality of second substrate pads, respectively.

WIRING BOARD AND ELECTRONIC DEVICE
20170318667 · 2017-11-02 · ·

A wiring board includes a first wire, a second wire, a third wire and a fourth wire formed over a substrate and extending in a first direction respectively, the second wire being adjacent to the first wire in the first direction, and the third wire being adjacent to the first wire in a second direction orthogonal to the first direction, and the fourth wire being adjacent to the second wire in the second direction, a pair of fifth wires, a pair of sixth wires, a pair of seventh wires and a pair of eighth wires formed in the substrate and extending in the second direction respectively, a pair of ninth signal vias, a pair of tenth signal vias, a pair of eleventh signal vias and a pair of twelfth signal vias formed in the substrate and extending in a third direction orthogonal to a surface of the substrate respectively.

Flexible printed circuit board and liquid crystal display

The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the widths of the gold fingers are different. By the above manner, the disclosure is able to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board.

CIRCUIT BOARD
20220053642 · 2022-02-17 ·

A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

Light-source module and light-emitting device

A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X.sub.1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X.sub.1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X.sub.1) of the light-emitting module.

Printed wiring board and connector connecting the wiring board

A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the wirings (9).

Method for assigning control channels
09723709 · 2017-08-01 ·

The present invention is a mobile device capable of transmitting or receiving wireless signals and incorporating an FPC shielded RF signal conductor for connecting transmitter and/or receiver circuitry to an associated RF antenna or antennas. In some embodiments FCP may incorporate the antenna in an unshielded section of the FPC. In some embodiments a single FPC may provide for multiple RF carrier conductors each with their own associated shielding.

Component carrier with embedded component having pads connected in different wiring layers

A component carrier includes a stack having at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, and a component embedded in the stack and having an array of pads on a main surface of the component. A first electrically conductive connection structure of the electrically conductive layer structures electrically connects a first pad of the pads up to a first wiring plane, and a second electrically conductive connection structure of the electrically conductive layer structures electrically connects a second pad of the pads up to a second wiring plane being different from the first wiring plane.

FLEXIBLE ILLUMINATING MULTILAYER STRUCTURE
20170265307 · 2017-09-14 · ·

A flexible and illuminating multilayer structure wherein the flexible and illuminating multilayer structure has at least two flexible foils laminated together. Each foil has a flexible electrically conductive pattern layer and LED units distributed over the foil, the LED units being electrically contacted with the contact pattern. The LED units of a foil are positioned between positions of the LED units of the other foils. At least one foil of the multilayer structure, towards which at least one of the LED units is configured to radiate light, is transparent to the light. Brightness of the LED units is at least foil-specifically controllable with operational electric power fed to the foils through the contact pattern. The LED units of at least one foil are of a different tone or color or are controlled to output a different tone or color than the LED units of at least one other foil.