A printed circuit board (PCB) for three-dimensional (3D) packaging that may facilitate packaging multiple electronic components therein is provided. The PCB may include one or more loading pads formed around signal or ground vias to facilitate impedance control and reduce likelihood of signal distortion. The loading pads may be formed on a plane in a body of a dielectric layer configured to form the PCB.

Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.

The invention relates to an electrically conductive film (10) having an electrically nonconductive substrate layer (12), and an electrically conductive metal layer (14) that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (12).

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

A transmission module includes a flexible printed wiring board including a signal line, a connector mounted on the flexible printed wiring board, and a reinforcing member disposed at a position opposing the connector with the flexible printed wiring board therebetween. The signal line includes a pad connected to a terminal of the connector. The reinforcing member includes a first portion disposed in a region including at least part of the pad as viewed in a direction perpendicular to a main surface of the flexible printed wiring board, and a second portion disposed around the first portion as viewed in the direction perpendicular to the main surface. A member constituting the first portion is a member having a nature that reduces a characteristic impedance of the pad more than a member constituting the second portion does.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.

Embodiments include a package substrate, a method of forming the package substrate, and a semiconductor package. A package substrate includes a conductive layer in a dielectric, a first trace and a first via pad of the conductive layer having a first thickness, and a second trace and a second via pad of the conductive layer having a second thickness. The second thickness of second trace and second via pad may be greater than the first thickness of the first trace and first via pad. The dielectric may include a first dielectric thickness and a second dielectric thickness, where the second dielectric thickness may be less than the first dielectric thickness. The package substrate may include a third via having a third thickness on the first via pad, and a fourth via having a fourth thickness on the second via pad, wherein the third thickness is greater than the fourth thickness.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.

An apparatus includes a first conductor trace arranged to electrically couple a first complementary signal to provide differential signaling. The first conductor trace includes a first plurality of split traces to conduct the first complementary signal, and a first plurality of tie bars to connect the first split traces.