A display panel and a display module are disclosed. The display panel includes a second lead wire disposed corresponding to a first lead wire in an intersecting arrangement and insulated from the first lead wire. A first projection area is defined by a projection of the first lead wire projected on the second lead wire, and a second projection area is defined by a projection of the second lead wire projected on the first lead wire. A via hole is disposed in the first projection area or the second projection area. The display panel is configured to mitigate capacitance interference between the first lead wire and the second lead wire, and to further improve display performance of the display panel.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

A flexible printed circuit board includes: a base film; a first circuit pattern disposed on an upper surface of the base film; a second circuit pattern disposed on a lower surface of the base film; and a boundary reinforcing pattern expanding the first circuit pattern in a width direction of the first circuit pattern based on a virtual boundary along which the first circuit pattern and the second circuit pattern meet each other in an overlay of the first circuit pattern and the second circuit pattern.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.

A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm.

The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

A printed circuit board has a solder joint inspection system including a substrate surface having at least one solder pad thereon, at least one conductor wire having an end attached to the at least one solder pad, and a first inspection feature. A first inspection feature is marked on the substrate surface adjacent to the at least one solder pad to define a conductor end zone on the at least one solder pad. The end of the conductor wire is in the conductor end zone when properly attached. The at least one solder pad may define a second inspection feature to mark an extent to which the at least one solder pad is covered by a flow of solder when the wire is properly attached.

A package includes a first and a second package component. The first package component includes a first metal trace and a second metal trace at the surface of the first package component. The second metal trace is parallel to the first metal trace. The second metal trace includes a narrow metal trace portion having a first width, and a wide metal trace portion having a second width greater than the first width connected to the narrow metal trace portion. The second package component is over the first package component. The second package component includes a metal bump overlapping a portion of the first metal trace, and a conductive connection bonding the metal bump to the first metal trace. The conductive connection contacts a top surface and sidewalls of the first metal trace. The metal bump is neighboring the narrow metal trace portion.

This document describes techniques and apparatuses directed to the mitigation of physical impact-induced mechanical stress damage to printed circuit boards through the utilization of a conductive shield track having a varied width (dynamic width). In an aspect, disclosed is a device that includes a printed circuit board, an electrical component on the printed circuit board in a shielded area, a conductive shield track on the printed circuit board, a component shield having a sidewall and a sidewall base, and solder disposed between the sidewall base and the conductive shield track to couple the component shield to the ground plane of the PCB to form a shielded compartment over the shielded area.