Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

The manufacturing method includes (a) preparing first printed circuit board and second printed circuit board, the first printed circuit board being provided with a plurality of first terminals, the second printed circuit board being provided with a plurality of second terminals, and the first terminals or the second terminals being coated with solders; and (b) connecting the first terminals and the second terminals, respectively, via respective solders by performing thermocompression on connecting portions of the first printed circuit board and the second printed circuit board. Each second terminal includes a first end portion and a second end portion in a long axis direction, and in the step (b), pressure is applied to each second terminal such that the height of each of the first end portion and second end portion is larger than the height in another portion of the second terminal.

Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

An electronic device including a housing; a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers; a first electrical component formed as at least a part of or in the housing; a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated; and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.

An electrical contact pad for electrically contacting a connector includes a first region having a first length in a longitudinal direction, and a second region having a second length in the longitudinal direction that is greater than the first length. The first region is arranged to contact a first arm of the connector and the second region is arranged to contact a second arm of the connector. The first length being smaller than the second length results in an increase in the impedance of the electrical contact pad as compared to typical contact pads which tend to correspond to low impedance regions.

An electrical contact pad for electrically contacting a connector includes first, second and third regions. The first region is connected to a trace. The second region is adjacent to the first region and has a width less than the first region. The third region is adjacent to the second region and has a width that is greater than the second region. The third region is sized to make contact with a connector. Having the width of the second region be smaller than the width of the first and third regions increases an impedance of the electrical contact pad.

A liquid ejection head includes a circuit board having a wire pattern divided into a plurality of portions in order to provide the circuit board with very reliable bonding.

A conductor track arrangement for high-frequency signals is provided. The arrangement has a carrier and a layered signal conductor arranged on the carrier. The layered signal conductor is delimited by a first end, a second end, an inner edge, and an outer edge. The layered signal conductor changes direction in a deflection area and has a minimum width in the deflection area. At least one of the inner and outer edges has a curvature in the deflection area. The deflection area is between the first and second ends.

A circuit board assembly for an electronic device, comprising: a main circuit board provided with a ground plane and at least one electronic component for performing one or more functions of the electronic device; a wireless module board spaced apart from and over the main circuit board, the wireless module board being provided with a feed line and at least one wireless module for performing wireless operations; and an antenna element for wireless communication, the antenna element comprising a resonating element, a first connection element connected to the feed line of the wireless module board and a second connection element connected to the main circuit board.