A connector device that includes a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector contains a resin material and fibrous inorganic fillers, a groove is formed in a region of a surface of the housing that is covered with the molded resin, the groove being formed by removing the resin material with the inorganic fillers remaining, and extending in a direction that intersects a mounting direction in which a counterpart connector is to be mounted to the connector, the groove has a depth and a width in a range from 50 μm to 150 μm inclusive, and the groove is filled with the molded resin.

A circuit board with a connector connection for the direct contacting with a connector, wherein the connector connection is formed on the front side of the circuit board with a contact pin that is arranged centrally in a blind hole while forming a circular ring-shaped cylindrical insertion space and that has an inner hole with a first contact zone of an inner conductor for contacting an inner conductor of the connector. A second contact zone of an outer conductor is arranged in the insertion space for contacting an outer conductor of the connector.

An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

A plug connector used to mate with the socket connector includes: a housing; a printed circuit board received in the housing, the circuit print board having plural soldering points; and a cable electrically connected to the soldering points of the printed circuit board, wherein the soldering points are provided with glue blocks to protect a connection between the printed circuit board and the cable.

A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material.

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

A circuit board with a connector connection for the direct contacting with a connector, wherein the connector connection is formed on the front side of the circuit board with a contact pin that is arranged centrally in a blind hole while forming a circular ring-shaped cylindrical insertion space and that has an inner hole with a first contact zone of an inner conductor for contacting an inner conductor of the connector. A second contact zone of an outer conductor is arranged in the insertion space for contacting an outer conductor of the connector.