A memory card includes a memory card body dimensioned to house at least one integrated circuit die package. The memory card body, in certain embodiments, includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface. The memory card also includes a contact pad disposed on at least one side surface of the plurality of side surfaces. The contact pad includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.

An example printed circuit board (PCB) includes a substrate having layers of a dielectric material, where the layers of dielectric material include a first layer and a second layer; a conductive trace that is between the first layer and the second layer and that is parallel to the first layer and the second layer along at least part of a length of the conductive trace; and a conductive via that extends at least part-way through the layers of dielectric material and that connects electrically to the conductive trace, where the conductive via is configured also to connect electrically to a signal input to receive or to transmit a signal that has a center frequency span.

An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.

An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

A flexible circuit board includes a flexible substrate having a first portion, a second portion, and a first side defining part of the first portion and the second portion. Electrical components are disposed on the first side in the first portion and in the second portion. The flexible substrate is folded between the first portion and the second portion such that the first portion overlays the second portion and the first side is directed outwards.

A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material.

A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

The present invention relates to an edge connector (1) for a printed circuit board (50), comprising an at least two-part housing (10) with a first housing part (20) and a second housing part (30), wherein the first housing part (20) has a recess (25) in which at least one conductor (15) is arranged, said at least one conductor (15) having a first limb (16) with a first end (17) and a second limb (18) with a second end (19), wherein the housing (10) comprises a first region (12) in a first plane (11), in which each first end (17) protrudes out of the housing (10) in an assembly direction (5) in order to connect to a conductor track (54) of the printed circuit board (50), and the housing (10) has a second region (14) in a second plane (13) which is arranged parallel and at a distance to the first plane (11) in the assembly direction (5), wherein the second limb (18) is arranged at an angle of 90° to the first limb (16), and the second limb (18) protrudes into a mating plug recess (35) in the second housing part (30) in a plug-in direction (6). The present invention additionally relates to a printed circuit board assembly (2) with at least one such edge connector.

An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

According to one embodiment, a magnetic disk device includes a housing having a box-shaped base with a bottom wall, a first connection portion provided inside the bottom wall, a second connection portion provided outside the bottom wall and electrically connected to the first connection portion, a control circuit board provided outside the housing, a third connection portion fixed to an inner surface of the control circuit board facing the bottom wall, and abutting on and electrically connecting to the second connection portion, and a reinforcement member positioned between the control circuit board and the bottom wall and provided around the third connection portion.