A low insertion force contact includes a conductive base layer extending to a mating end including a mating interface configured for mating electrical connection to a mating contact. A silver coating layer is provided on the conductive base layer. The silver coating layer is provided at the mating end. A silver sulfide surface layer forms a solid lubricant directly on the silver coating layer. The silver sulfide surface layer forms a film defining a surface of the low insertion force contact having a controlled thickness at the mating interface.

An electronic display where various electrical components may be removed from a housing of the display and serviced or replaced without having to demount the display. The electronic display may include an electronic image-producing assembly in electrical communication with a backplane. Various electrical components (e.g., electronic assemblies) may be removably connected to the backplane using self-guiding electrical connectors. An access opening through a wall of the housing may be provided to facilitate removal of an electrical assembly through the housing while the display remains mounted to a vertical surface.

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

A resin-sealed in-vehicle electronic control device in the present disclosure is a resin-sealed in-vehicle electronic control device including a circuit board on which an electronic component is mounted, a connector housing that electrically connects the circuit board to an external terminal, and a sealing resin fixing the connector housing to the circuit board. The connector housing has a through hole allowing communication between a second end surface located opposite to a first end surface on which the external terminal is mounted and a side surface of the connector housing adjoining the second end surface, and the sealing resin is continuous to fill at least the inside of the through hole and cover a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board.

A driver for motors according to the present invention is provided with: an aluminum substrate (10) which forms one surface of a housing; an insulating layer (11) which is formed on a surface of the aluminum substrate (10); a plurality of electronic elements (13) which are bonded onto a surface of the insulating layer (11), said surface being on a side opposite to the aluminum substrate (10); and a resin member (14) that covers the surface onto which the electronic elements (13) are bonded. This driver for motors is characterized in that the resin member (14) is obtained by integrating a mold resin part (20) which covers the electronic elements (13) from the upper surface side, a connector (21) which is electrically connected to the electronic elements (13), and a fitting part (22) which is used for fitting to a motor.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

This application provides a printed circuit board. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than that of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured.

The electronic device includes: a substrate having an electronic circuit formed therein; a housing for housing the substrate; and a connector disposed on the substrate and serving as an interface between outside and inside of the housing. The substrate has a main circuit pattern portion that forms a main circuit and a frame ground pattern portion that forms a frame ground. The main circuit pattern portion and the frame ground pattern portion are disposed so as not to overlap each other on the substrate and in the substrate. A terminal of the connector is disposed in the frame ground pattern portion.

A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).