A power resistor is disclosed, having at least one electrical connection, having a carrier substrate, which has at least one resistor element composed of a thick-film material and at least one contact electrode to which the resistor element electrically connects, having at least one electrical conductor, which is soldered to the contact electrode and produces an electrical connection between the contact electrode and the electrical terminal, and having a housing, which is at least partially filled with at least one casting compound and in which the resistor element and contact electrode are encapsulated, with the electrical conductor protruding out through the casting compound. In order to achieve a simply designed and easy-to-use power resistor, it is proposed for a pin, in particular a soldering pin or press-fitting pin, to constitute the electrical conductor, which pin is placed onto the contact electrode and soldered to it and constitutes the electrical terminal of the power resistor.

Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

A fastening system comprises two interconnecting components for fastening electronic components which can be joined by snap-fit when a fastener component is pressed against a retainer. The fastening system consists of a fastener stud with a planar base at the bottom and an upwardly extending shank with a neck portion of reduced diameter adjacent the base. The stud has a spherical ball portion with a flat planar top surface at a distal top end. The fastener stud mates with a retainer having a planar base and affixed opposing resilient arms extending orthogonally from the base centered about a rotational axis. The arms preferably have compound shaped inner surfaces symmetrical about the axis. These surfaces comprise a cylindrical portion adjacent the base and a spherical portion adjacent the distal ends of the arms.

An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

A control panel of an appliance includes a film comprising conductive ink embedded in the film. A header on the film is in electrical communication with the conductive ink embedded in the film. The control panel also includes a printed circuit board. The film is directly mounted to the printed circuit board via the header. With this direct mounting, the printed circuit board is in operative communication with the conductive ink embedded in the film.

A system and method for dissipating heat from a package and reducing interference between signaling pins is disclosed. The system includes a circuit substrate that includes a dielectric layer and at least one metal layer having an external surface. A plurality of metal posts is disposed on the external surface that function to a least one of dissipate heat from the circuit substrate, shield interfering signals between the signaling pins, and interact with mounting substrates on corresponding componentry. One or more metal posts are merged, increasing the interference shielding and heat dissipation functions of the metal posts.

The assembling performance of an electronic control device can be improved. An electronic control device includes a control board 12 and a power source conversion board 13. The control board 12 includes a first power source terminal 15, a first GND terminal 16, and a male floating connector 17 on one surface. The power source conversion board 13 includes a second power source gripping terminal 18 electrically connected to the first power source terminal 15, a second GND gripping terminal 19 electrically connected to the first GND terminal 16, and a female floating connector 20 electrically connected to a male floating connector 17 on one surface.

The assembling performance of an electronic control device can be improved. An electronic control device includes a control board 12 and a power source conversion board 13. The control board 12 includes a first power source terminal 15, a first GND terminal 16, and a male floating connector 17 on one surface. The power source conversion board 13 includes a second power source gripping terminal 18 electrically connected to the first power source terminal 15, a second GND gripping terminal 19 electrically connected to the first GND terminal 16, and a female floating connector 20 electrically connected to a male floating connector 17 on one surface.