A touch display device includes a printed circuit board and a cover. The printed circuit board has a top surface, a bottom surface and soldering points. The printed circuit board includes a first printed circuit, a light element and a second printed circuit. A part of the first printed circuit is on the top surface or the bottom surface and connected with the corresponding soldering point. The light emitting element is on the top surface and electrically connected to the first printed circuit. On the top surface, the second printed circuit does not overlap with the first printed circuit. The cover covers the printed circuit board. The cover has light transmission areas which are aligned with the light elements. The second printed circuit is configured to provide a capacitance value coupled to a capacitive sensing element coupled between the second printed circuit and the cover.

A high-speed transmission circuit comprises a connector pin that serves as part of a signal path, has a first conductivity, and has a connector pin leg that is coupled to a pad that has a second conductivity lower than the first conductivity. The connector pin leg and at least a portion of the pad form a resonant sub-circuit coupled to the signal path. The second conductivity causes a reduction in insertion loss in the signal path by damping a current in the resonant sub-circuit.

A printed circuit board assembly has a first printed circuit board with first and second surfaces, a plurality of electrical contact pins which pass through the first printed circuit board, wherein first ends of the contact pins are electrically contacted on the second surface by soldered elevations, and with first electrical contacts which are arranged on the second surface; and a second printed circuit board with first and second surfaces in which a plurality of blind holes are formed for receiving the first ends of the contact pins, wherein the second printed circuit board has second electrical contacts on the second surface, and the second surfaces of the first printed circuit board and the second printed circuit board are joined together such that the contact pins reach into the blind holes such that the first electrical contacts electrically contact the second electrical contacts.

A display panel and chip-on-film (COF) package bonding structure is provided and includes a display panel including a panel substrate and a plurality of panel bonding pins. The panel bonding pins are disposed on the panel substrate and are arranged along a lateral direction. Each of the panel bonding pins is trapezoidal and is directed along a longitudinal direction. A COF package is bonded to the display panel and includes a package substrate and a plurality of package bonding pins. The package bonding pins are disposed on the package substrate, are arranged along the lateral direction, and are bonded to the panel bonding pins respectively. Each of the package bonding pins is trapezoidal and along the longitudinal direction. The trapezoidal panel bonding pins and package bonding pins can be aligned with and contacts each other.

An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.

An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

Disclosed herein are communication devices and connected clothing systems. The communication devices comprise a circuit printed on a portion of fabric, the circuit comprising means for transmitting electrical signals to and from a user, a controller electrically pairable to the circuit, and means for attaching the circuit to an item of apparel. Connected clothing systems comprises a communication device as disclosed herein attached to an item of apparel.

An electronic device includes an interposer substrate including a substrate body that includes a first principal surface and a second principal surface, a first surface terminal electrode that is provided on the first principal surface and includes a terminal electrode for heat dissipation and a terminal electrode for external connection, a second surface terminal electrode that is provided on the second principal surface, a conductor for signal transmission that is provided on the substrate body and connects the terminal electrode for external connection and the second surface terminal electrode, and a conductor for heat conduction that is provided on the substrate body and connects the terminal electrode for external connection or the second surface terminal electrode to the terminal electrode for heat dissipation.

A voltage regulator module includes a first circuit board assembly and a signal communication part. The first circuit board assembly includes a plurality of first conduction pads. The signal communication part is arranged on the first circuit board assembly. The signal communication part includes a conduction circuit board with a plurality of conduction fingers and a plurality of surface pins. The plurality of conduction fingers are formed on at least one lateral side of the conduction circuit board. The plurality of surface pins are electroplated on a top side and a bottom side of the conduction circuit board. A first end of each conduction finger is contacted with the corresponding surface pin on the top side. A second end of each conduction finger is contacted with the corresponding surface pin on the bottom side. The signal communication part is fixed on and electrically connected with the first circuit board assembly.

A control module of an appliance is provided. The control module includes a housing having a film integrally molded onto an outer surface of the housing. The film includes conductive ink embedded in the film. A header on the film is in electrical communication with the conductive ink embedded in the film. The control module also includes a printed circuit board mounted within the housing proximate an inner surface of the housing. The film is connected to the printed circuit board via the header. With this connection, the printed circuit board is in operative communication with the conductive ink embedded in the film.