Disclosed herein are communication devices and connected clothing systems. The communication devices comprise a circuit printed on a portion of fabric, the circuit comprising means for transmitting electrical signals to and from a user, a controller electrically pairable to the circuit, and means for attaching the circuit to an item of apparel. Connected clothing systems comprises a communication device as disclosed herein attached to an item of apparel.

A power module includes a power source module and a metallic bottom heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a top surface and a bottom surface. At least a heat-generating component is disposed on the bottom surface. The metallic bottom heat-dissipation substrate has an upper surface and a lower surface opposite to each other. The upper surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the bottom surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The lower surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.

Disclosed herein are communication devices and connected clothing systems. The communication devices comprise a circuit printed on a portion of fabric, the circuit comprising means for transmitting electrical signals to and from a user, a controller electrically pairable to the circuit, and means for attaching the circuit to an item of apparel. Connected clothing systems comprises a communication device as disclosed herein attached to an item of apparel.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

The invention provides a stacked structure of circuit boards applied to a data storage device. The stacked structure comprises a main circuit board and a slave circuit board. The main circuit board comprises a controller, a plurality of flash memories, a first connector, and a first transmission interface. The slave circuit board comprises an operation management chip, a second connector, and a second transmission interface. The operation management chip comprises a microprocessor and a network communication element. The slave circuit board is stacked on the main circuit board, and connected to the first connector of the main circuit board via the second connector. When the slave circuit board receives a specific operation instruction, the microprocessor of the slave circuit board will transmit the specific operation instruction to the electronic apparatus via the second transmission interface, the electronic apparatus executes a corresponding operation according to the specific operation instruction.

An LED filament and lamp, and a manufacturing process of an LED filament, the LED filament includes a PCB substrate and multiple LED chips, connecting circuits are provided on the PCB substrate, a positive pin and a negative pin are provided at two ends of the connecting circuit, respectively, and each LED chip is electrically connected to the connecting circuit; and a fluorescent glue layer is provided outside the PCB substrate and the LED chips, and the positive pin and the negative pin are exposed from the fluorescent glue layer. The LED lamp includes the LED filament. The manufacturing process of an LED filament enables manufacturing an LED filament. For the LED filament and lamp, and the manufacturing process of an LED filament, a PCB substrate is used as a base material, connecting circuits are fabricated on the PCB substrate, the connecting circuits are directly used for connecting LED chips.

A gantry for thermal management is disclosed, including: a heat generating component that includes a top surface and a bottom surface; a heat sink; a thermally conductive and electrically insulating material that is in direct contact with the heat sink; and a gantry extending above the heat generating component, wherein the gantry pushes a pin against the top surface of the heat generating component such that the bottom surface of the heat generating component is pushed against the thermally conductive and electrically insulating material.

Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

A printed circuit board assembly has a first printed circuit board with first and second surfaces, a plurality of electrical contact pins which pass through the first printed circuit board, wherein first ends of the contact pins are electrically contacted on the second surface by soldered elevations, and with first electrical contacts which are arranged on the second surface; and a second printed circuit board with first and second surfaces in which a plurality of blind holes are formed for receiving the first ends of the contact pins, wherein the second printed circuit board has second electrical contacts on the second surface, and the second surfaces of the first printed circuit board and the second printed circuit board are joined together such that the contact pins reach into the blind holes such that the first electrical contacts electrically contact the second electrical contacts.