The invention concerns a device for controlling at least one diode 2, the control device comprising an electrical card 4 comprising a printed circuit 5 on which the following are mounted: a diode 2, a front component 7 and a storage capacitor 9 connected in such a way as to form a circuit loop 17 extending substantially in a thickness of the electrical card 4.

Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector module and the second connector module, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.

A communication system includes a circuit board assembly including a mating circuit board having a mating edge and a plurality of mating pads at the mating edge, the circuit board assembly having an electrical component electrically coupled to the mating circuit board. The communication system includes a cable receptacle connector removably coupled to the mating edge of the mating circuit board. The cable receptacle connector includes a connector housing having a connector cavity and a card slot. A cable extends from the connector housing. The cable receptacle connector includes signal contacts each having a mating end mated with the corresponding mating pads and a terminating end electrically connected to a cable conductor of the cable.

Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.

The disclosure relates to systems and methods for using additive manufacturing (AM) to fabricate printed circuits having side-mounted components and contacts. More specifically, the disclosure is directed to additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB's together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each of the printed AMEs.

Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.

A cable connector assembly includes: an electrical connector; a circuit board electrically connected to the electrical connector and including a first row of pads and a second row of pads located behind the first row of pads and separated from the first row of pads; and a cable electrically connected to the circuit board and including plural coaxial wires each including a center conductor and a shielding layer and plural single core wires each comprising a conductor; wherein the center conductors of the coaxial wires are soldered to the first row of pads of the circuit board, and the conductors of the single core wires and the shielding layers of the coaxial wires are soldered to the second row of pads of the circuit board.

A touch module includes a sensing element, a circuit element, and an optical element. The sensing element has a sensing circuit and a first connecting zone. The sensing circuit extends to the first connecting zone. The circuit element has a first conductive portion. The sensing circuit extending to the first connecting zone is electrically connected with the first conductive portion. The optical element has a connecting notch. The sensing element is disposed on the optical element. The first connecting zone corresponds to the connecting notch. The sensing circuit extending to the first connecting zone is exposed from the optical element.

A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

An electrical connector including an insulating body, a plurality of terminals disposed in the insulating body, a first metallic shell enclosing the insulating body to form an interface for being plugged by another electrical connector, and a second metallic shell is provided. The first metallic shell has a first soldering leg close to the interface, and the second metallic shell encloses the first metallic shell, wherein the first soldering leg extends away from the insulating body, penetrates the second metallic shell and protrudes out of the second metallic shell.