The present disclosure relates to a substrate apparatus and a method of manufacturing a substrate apparatus capable of improving a manufacturing quality and reliability of the substrate apparatus as an electronic device. By laminating a plurality of sheet-like substrates on which a wiring pattern is formed, an individual substrate in which internal wiring is formed is formed, and the individual substrate physically and electrically connects two substrates. The present disclosure is capable of being applied to the substrate apparatus.

A light-emitting module is provided with a light-emitting element, a base, and a wiring pattern. The base includes an installation surface facing in a first direction and a mounting surface facing in a second direction which is at right angles to the first direction. The light-emitting element is installed on the installation surface. The wiring pattern is formed on the base and is in electrical contact with the light-emitting element. The base includes a pair of mounting recesses recessed from the mounting surface and spaced from each other in a third direction which is at right angles to both the first direction and the second direction. The wiring pattern includes a pair of mounting-surface electrodes respectively covering at least a part of the pair of mounting recesses.

A connection system for a printed circuit board employs either an inline or transverse board-mounted connector for holding board-mounted optical fibers. A plug-in connector can blind mate with the board-mounted connector. The plug-in connector has a plug-in connector body, a plug-in ferrule, and a plug-in ferrule holder. The plug-in holder latches with the plug-in connector body at either of two positions to selectively configure the plug-in connector for blind mating with either the inline or transverse board-mounted connector. The board-mounted fibers can be supported by a board-mounted ferrule assembly including a ferrule and a ferrule holder that is configured to selectively attach the board-mounted ferrule assembly to either of an inline board-mounted connector body and a transverse board-mounted connector body.

A semiconductor component includes first and second connection contacts provided to electrically contact a semiconductor body, a carrier on which a semiconductor chip is arranged, the carrier including a base body including a chip mounting surface and a connection surface opposite the chip mounting surface and at least one side surface, that connects the chip mounting surface to the connection surface, a first electrically conductive contact layer electrically conductively connected to the first connection contact, and a second electrically conductive contact layer electrically conductively connected to the second connection contact, wherein the first and the second contact layer are applied to the base body and each include a first partial region arranged on the chip mounting surface, a second partial region arranged on a side surface and a third partial region arranged on the connection surface, and wherein the base body contains a radiation-transmissive base material.

A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of the cavity, the exterior connection elements able to interconnect with an exterior circuit such that the side wall faces the exterior circuit when the exterior connection elements are interconnected with the circuit.

There is provided a multilayer ceramic electronic component including, a ceramic body including a plurality of dielectric layers stacked in a thickness direction, satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, and having a groove portion inwardly recessed in a length direction in at least one main surface thereof, a plurality of first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to extend from the both end surfaces of the ceramic body to the at least one main surface having the groove portion formed therein.

The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.

Techniques for construction of an electric meter base level printed circuit board (PCB), such as for use in an electric consumption meter, are described herein. A plurality of heavy copper traces may be embedded in the PCB, thereby eliminating the need for heavy copper bar between connectors and components on the board. In one example, a PCB includes connectors for incoming and outgoing line and neutral conductors. The PCB may include a current measuring component, mounted on the PCB, to communicate with metrology circuitry. The PCB may include one or more switches, configured to regulate electrical service. Heavy electrical traces may be embedded in the PCB to connect the connectors and various components mounted on the PCB. The heavy electrical traces are sized to allow passage of currents that may be in excess of 100 amps.

First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.

The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.