Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

A transformer, according to one embodiment, includes a core unit, a first coil unit and a second coil unit, and a terminal bobbin coupled to one side of the second coil unit in a first direction, wherein the first coil unit includes a first coil and a first bobbin, wherein the second coil unit includes a second coil and a second bobbin, wherein the terminal bobbin includes a plurality of first terminals disposed on one side of the terminal bobbin that is oriented in the first direction, and an opening formed in another side opposite the one side in the first direction to allow one side of the second coil unit to be inserted thereinto, and wherein two end portions of the first coil are led out from the first bobbin and are respectively connected to different first terminals among the plurality of first terminals of the terminal bobbin.

The invention relates to a holder for a button cell, wherein the holder is intended to be fastened on a printed circuit board, wherein the holder has at least two first latching arms which protrude from the printed circuit board when the holder is in the mounted state, wherein the button cell is received between the first latching arms when the button cell is in the mounted state, wherein the first latching arms, at one end, are each connected to a main body which has a base area which is connected to the printed circuit board when the holder is in the mounted state, wherein the first latching arms each have at least one first latching lug in order to hold the button cell on the printed circuit board, and wherein the first latching lugs are arranged at a first distance from the base area of the main body.

A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

An aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber and an aerosol chamber respectively arranged at two opposite sides of the atomizing module. The atomizing module includes an annular vibration plate, a microporous member, and a circuit board. The vibration plate has a first hole, and the microporous member is disposed on the vibration plate and covers the first hole. The circuit board is electrically coupled to an electrical contact of the vibration plate. The circuit board is arranged at one side of at least part of the vibration plate, and the circuit board and the at least part of the vibration plate have a gap there-between. A projected region defined by orthogonally projecting the circuit board onto a plane overlapping with the electrical contact partially covers the least part of the vibration plate.

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

A supercapacitor assembly is disclosed that includes a supercapacitor enclosed within a housing. The housing may have an outer surface and may be sealed at a seal location. A barrier layer may be formed on a portion of the outer surface that is adjacent at least one of the seal location or a surface to which the supercapacitor is mounted. The barrier layer may be a high performance polymer, such as a thermoplastic polymer or a thermoset polymer.

A transmission line has a signal electrode formed on one surface of a flexible printed circuit, and a ground electrode formed on the other surface of the flexible printed circuit. A connection terminal has signal terminals formed on both the surfaces of the flexible printed circuit and electrically connected to each other through a via hole, and ground terminals formed on both the surfaces of the flexible printed circuit and electrically connected to each other through the via hole. The signal terminal on the surface, on which the ground electrode is formed, is formed such that at least a width in an end portion on the transmission line side is narrower than a width of a part of the signal terminal on the surface, on which the signal electrode is formed, to be at the same position when the flexible printed circuit is seen in a plan view.