A strap for a wearable device comprises a printed circuit board (PCB) located within said strap. The PCB comprises a first electronic component, coupled to a first flexible portion. The first electronic component is mounted to a cage, the cage comprising a cage pivot mount. The flexible portion is under tension and urges said first electronic component towards said cage pivot mount such that a pivotable connection is formed between said cage and said first electronic component. Also disclosed is a method of manufacture of the strap.

A connection system for a printed circuit board employs either an inline or transverse board-mounted connector for holding board-mounted optical fibers. A plug-in connector can blind mate with the board-mounted connector. The plug-in connector has a plug-in connector body, a plug-in ferrule, and a plug-in ferrule holder. The plug-in holder latches with the plug-in connector body at either of two positions to selectively configure the plug-in connector for blind mating with either the inline or transverse board-mounted connector. The board-mounted fibers can be supported by a board-mounted ferrule assembly including a ferrule and a ferrule holder that is configured to selectively attach the board-mounted ferrule assembly to either of an inline board-mounted connector body and a transverse board-mounted connector body.

A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.

The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

A wiring board includes a first insulation layer comprising first and second surfaces; a second insulation layer located at an outermost layer on the first surface; a third insulation layer located at an outermost layer on the second surface; a first mounting region located on an outermost surface on the first surface; a second mounting region located on the outermost surface on the first surface and surrounding the first mounting region; a plane conductor located on the third insulation layer; and a solder resist covering the third insulation layer and the plane conductor and having an opening that exposes part of the plane conductor. In plane perspective, in a frame-shaped region between outer peripheral edges of the first and second mounting regions, the plane conductor comprises clearances at point-symmetric positions taking a center of the opening as a point of symmetry.

A mounting assembly and a circuit board assembly. The mounting assembly configured to mount a short or long expansion card on the circuit board. The mounting assembly includes a fixed plate and a rotatable plate. The rotatable plate includes a body part, a pivot part and a fastening part. The pivot part is rotatably disposed on the fixed plate. The fastening part has a fastening hole. A pivot axis of the pivot part is spaced apart from a central axis of the fastening hole. When the fastening hole is at the first mounting position, the fastening hole is located closer to the connector than the pivot part to fix the short expansion card. When the fastening hole is at the second mounting position, the fastening hole is located farther away from the connector than the pivot part to fix the long expansion card.

A printed circuit board includes a first substrate portion including a first insulating portion and a plurality of first wiring layers respectively disposed on or in the first insulating portion, a resin layer disposed to cover a side surface of the first insulating portion, and a second substrate portion including a second insulating portion disposed to cover each of an upper surface of the first insulating portion and an upper surface of the resin layer, and a second wiring layer disposed on or in the second insulating portion.

An electronic package module and a method for fabrication of the same are provided. The electronic package module has the circuit substrate with the flat surface and the electronic component located on the circuit substrate. The electronic component includes the input end located on the flat surface of the circuit substrate and electrically connected to the circuit substrate. The electronic component includes the main part located on the input end and the ground end located on the main part. The input end and the ground end are located on two opposite sides of the main part separately and are located between the ground end and the circuit substrate. The input end, the main part and the ground end are arranged along the normal direction of the flat surface.

A wiring board with a stiffener includes a wiring board, a mounting region located on an upper surface of the wiring board, and a stiffener located on the upper surface of the wiring board to surround the mounting region and including a first surface facing the wiring board and a second surface located opposite to the first surface. The wiring board has a first thermal expansion coefficient. The stiffener includes a first region facing the wiring board, including the first surface, and a second thermal expansion coefficient, and a second region located on a surface side opposite to the first region, including the second surface, and has a third thermal expansion coefficient. An absolute value of a difference between the first and second thermal expansion coefficients is smaller than an absolute value of a difference between the first thermal expansion coefficient and the third thermal expansion coefficient.

The present disclosure relates to a printed circuit board including a first insulating layer, a pad disposed on an upper side of the first insulating layer, a protrusion disposed on the pad; and a metal post disposed on the pad and covering the protrusion, wherein the metal post has a tapered shape, such that a width of an upper surface of the metal post is smaller than a width of a lower surface of the metal post, and a method of manufacturing the printed circuit board.