An element placement unit for placing a light emitting unit and a light receiving unit of a smoke detector that detects smoke by receiving scattered light caused by a scattering of light from the light emitting unit by the smoke, using the light receiving unit, includes: a light emission-side electrode portion having conductivity for placing the light emitting unit while electrically connecting the light emitting unit; and a light reception-side electrode portion having conductivity for placing the light receiving unit while electrically connecting the light receiving unit.

A display apparatus includes a display panel bendable in a bending direction about a bending axis, pad units disposed on one side of the display panel and arranged in the bendable direction, printed circuit boards disposed below the display panel, and flexible printed circuit boards configured to connect the display panel to the printed circuit boards. The printed circuit boards are bendable in the bending direction about the bending axis, are arranged in the bendable direction, and extend in the bendable direction. Each of the flexible printed circuit boards has a first end connected to the display panel and a second end connected to one of the printed circuit boards. A second distance between the second ends of two of the flexible printed circuit boards respectively connected to two adjacent printed circuit boards is greater than a first distance between the first ends of the two flexible printed circuit boards.

A spacer is provided to allow a surface mount device (SMD) to be surface mounted onto a PCB with greater degrees of freedom. The spacer is designed to be surface mountable to the PCB and includes an electrically non-conducting body that has a first surface facing the SMD, a second surface facing the PCB, and through holes and/or indents in the electrically non-conducting body to accommodate electrical conductors that provide electrical connections between the SMD and the PCB. The spacer may provide one or more of: an elevated height (so that the SMD is elevated above the PCB), an offset along the surface of the PCB relative to a designated position for the SMD on the PCB, or a tilt in one or more directions relative to a surface of the PCB.

A pad 11 is disposed at an end point of a first wiring 17 provided on a board 15, is connectable to one of N (N: an integer of two or more) wirings provided on the board 15 via a resistor or a conductor, and has (N+1) sides that are disposed by deforming respective sides of an equilateral polygon having (N+1) sides into convex sides each having a radius of curvature that is larger than a radius of curvature of a circumscribed circle of the equilateral polygon.

A user interface includes a curved outer surface, a generally flat printed circuit board defining a base plane, and a capacitive touch sensor connected to the generally flat printed circuit board and offset from the base plane. The capacitive touch sensor is substantially aligned with the curved outer surface. The user interface may be provided on an appliance.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

An LED light apparatus includes a back cover, a surrounding wall, a light source and a surface ring. The back cover has a top side and a back cover inner side. The surrounding wall is connected to the back cover. The light source is fixed to an inner wall side of the surrounding wall. The surface ring has a surface ring inner side connected to the surrounding wall. The surface ring inner side, the inner wall side and the back cover inner side form a light movement space. The back cover inner side has a three-dimension curve surface for reflecting light to the light opening of the surface ring.

An LED light apparatus includes a back cover, a surrounding wall, a light source and a surface ring. The back cover has a top side and a back cover inner side. The surrounding wall is connected to the back cover. The light source is fixed to an inner wall side of the surrounding wall. The surface ring has a surface ring inner side connected to the surrounding wall. The surface ring inner side, the inner wall side and the back cover inner side form a light movement space. The back cover inner side has a three-dimension curve surface for reflecting light to the light opening of the surface ring.

A control module of an appliance is provided. The control module includes a housing having a film integrally molded onto an outer surface of the housing. The film includes conductive ink embedded in the film. A header on the film is in electrical communication with the conductive ink embedded in the film. The control module also includes a printed circuit board mounted within the housing proximate an inner surface of the housing. The film is connected to the printed circuit board via the header. With this connection, the printed circuit board is in operative communication with the conductive ink embedded in the film.