A display apparatus includes a display panel bendable in a bending direction about a bending axis, pad units disposed on one side of the display panel and arranged in the bendable direction, printed circuit boards disposed below the display panel, and flexible printed circuit boards configured to connect the display panel to the printed circuit boards. The printed circuit boards are bendable in the bending direction about the bending axis, are arranged in the bendable direction, and extend in the bendable direction. Each of the flexible printed circuit boards has a first end connected to the display panel and a second end connected to one of the printed circuit boards. A second distance between the second ends of two of the flexible printed circuit boards respectively connected to two adjacent printed circuit boards is greater than a first distance between the first ends of the two flexible printed circuit boards.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A lighting device is described. The lighting device includes a support structure, which includes a central mounting face and at least one first lateral mounting face adjacent the central mounting face and forming an included angle with the central mounting face of 60 to 90. The device also includes at least one central light emitting element on the central mounting face and in contact with the support structure and at least one first lateral light emitting element on the first lateral mounting face and in contact with the support structure.

The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

The invention relates to a motor-vehicle headlamp (1), comprising at least one LED (4; 4a, 4d), which is attached by soldering, as an SMD, to metal surfaces (3-1, 3-2) of a printed circuit board (3) at connection points of said LED, and comprising an optical unit (2; 8), which emits the light emitted by the at least one LED into the traffic space, wherein, in order to set the emission direction of the at least one LED in a specific manner, said LED is attached by soldering with different solder thicknesses (d1, d2) between the connection points (4-1, 4-2) of said LED and the metal surfaces of the printed circuit board.

Embodiments of the present invention are directed to an integrated circuit (IC) package assembly. The IC package assembly includes a base printed circuit board (PCB), and a set of IC packages. Each of the IC packages includes at least one IC chip, mounted on or partly in a support component, which mechanically supports and electrically connects to the IC chip. In addition, each of the IC packages is laterally soldered to the base PCB (e.g., a motherboard PCB) and arranged transversally to the base PCB and forms an angle therewith. As a result, a slanted stack of IC packages is obtained, wherein the IC packages are essentially parallel to each other. Further embodiments are directed to related devices, including the above assembly, and to related fabrication methods.

A user interface includes a curved outer surface, a generally flat printed circuit board defining a base plane, and a capacitive touch sensor connected to the generally flat printed circuit board and offset from the base plane. The capacitive touch sensor is substantially aligned with the curved outer surface. The user interface may be provided on an appliance.

A connection body for use with an endoscope that provides an electrical connection between at least one electrical component arranged in a proximal end region of the endoscope and an internal electrical connection provided in the proximal end region. The connection body including: a dimensionally stable three-dimensional circuit carrier: and a flexible elongate circuit board. Where, in a first region of the circuit carrier, the electrical component is mechanically directly connected to the circuit carrier and is contacted by conductor tracks provided in the circuit carrier; in a second region different from the first region, a first end of the circuit board is mechanically directly connected to the circuit carrier and contacts the conductor tracks for electrical connection to the electrical component and a second end of the circuit board opposite the first end in a longitudinal direction of the circuit board, contacts the internal electrical connection.

An aircraft LED light unit comprises at least one printed circuit board which comprises at least one metal core layer and at least one dielectric layer, and at least one LED disposed on the printed circuit board and which comprises an anode and a cathode for electrically coupling to a power source. One of the anode and cathode of the at least one LED is connected to an electrical conductor which is disposed on the dielectric layer and is coupled to a first terminal of the power source, wherein the dielectric layer electrically isolates the electrical conductor from the metal core layer, and the other one of the anode and cathode of the at least one LED is connected to the metal core layer of the at least one printed circuit board, wherein the metal core layer is coupled to a second terminal of the power source.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.