Disclosed herein are a printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad. According to the present invention, a cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure.

According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a liquid crystal layer and a light source that emits light to the liquid crystal layer, and the first substrate includes a first portion opposing the second substrate and having a first thickness and a second portion not opposing the second substrate and having a second thickness which is less than the first thickness, and the light source is disposed on the second portion, and the light source includes a first surface opposing the second portion and a second surface opposing the first surface, and a wiring substrate is disposed on the second surface so that the wiring substrate does not protrude with respect to the second substrate in a thickness direction.

Present embodiments are directed to a battery module including a venting assembly and a method of manufacturing the battery module. The venting assembly may, in certain embodiments, be designed to vent gases from a plurality of battery cells disposed in a housing of the battery module. Each of the plurality of battery cells may include a battery cell vent. The venting assembly may include a lid designed to be coupled to the housing and disposed over the battery cells in the housing. In some embodiments, the lid includes a vent chamber formed in the lid and designed to receive and direct gases vented from the plurality of battery cells away from the battery module.

A printed circuit board arrangement, is provided having a first printed circuit board with at least two first contact elements fastened thereto and protruding vertically therefrom, a second printed circuit board with at least two second contact elements fastened thereto, protruding vertically therefrom and corresponding to the first contact elements, and a plastics housing which is mounted on the first printed circuit board and in which the first contact elements are held with a form fit and the second contact elements are mounted displaceably.

A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

A battery module including bus bar cell interconnects and a method of manufacture are provided. The battery module may, in certain embodiments, include a housing, a plurality of battery cells disposed in the housing, and a bus bar cell interconnect. The bus bar cell interconnect is designed to electrically couple a first battery cell and a second battery cell. In some embodiments, the bus bar cell interconnect includes a first end electrically coupled with a first terminal of the first battery cell and a second end electrically coupled with a second terminal of the second battery cell. The bus bar cell interconnect also includes a curved portion disposed between the first end and the second end, and the bus bar cell interconnect is designed to distribute stress across the curved portion.

A modular printed circuit board assembly is provided. The modular printed circuit board assembly includes a housing unit. The housing unit includes a plurality of connectors, a heat transfer unit, and an identification unit. The plurality of connectors connects a host interface board of a plurality of host interface boards with a plurality of module boards and connects a module board of the plurality of module boards with the plurality of host interface boards. The host interface board includes information about an electronic device. The heat transfer unit dissipates the heat to a heat sink. The heat sink is a passive heat exchanger for conducting the heat generated by the electronic device. The identification unit is configured to read the unique identification of the electronic device from the host interface board to determine a structural combination of the electronic device.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

A lid assembly for use in a battery module includes a lid with apertures extending through the lid in a vertical direction, where each of the apertures is configured to receive a terminal of a battery cell of the battery module. The lid assembly also includes one or more extensions extending away from the lid in the vertical direction. Each of the one or more extensions is configured to couple the lid to a printed circuit board assembly of the battery module. The lid assembly also includes walls extending away from the lid in the vertical direction. Each of the walls is configured to extend between a first terminal of a first battery cell and a second terminal of a second battery cell.

A battery module includes a housing configured to hold prismatic battery cells within a space defined by four interior walls of the housing. The housing includes a first interior wall that includes partitions extending upwards from a bottom of the housing and a second interior wall that includes partitions extending upwards from the bottom of the housing. The first interior wall faces opposite the second interior wall. The partitions disposed on the first interior wall and the partitions disposed on the second interior wall define slots between adjacent partitions, where each of the slots increases in width between the adjacent partitions from the bottom of the housing upwards. Each of the slots is configured to retain one of the prismatic battery cells.