A circuit for EMC 1 in a power input circuit includes at least two wirings of a high-potential-side wiring 2 and a low-potential-side wiring 3 having different potentials and formed on a circuit board, a cutoff part 6 having one end connected to the high-potential-side wiring 2, a capacitor 10 connected between the other end of the cutoff part 6 and the low-potential-side wiring 3, a cutoff part 7 having one end connected to the high-potential-side wiring 2, a capacitor 20 connected between the other end of the cutoff part 7 and the low-potential-side wiring 3, and a capacitor 30 connected between a connection part 4 where the cutoff part 6 and the capacitor 10 are connected and a connection part 5 where the cutoff part 7 and the capacitor 20 are connected. This can reduce the number of capacitors while preventing a decrease in the capacitance.

A touch LED component and a touch device, and the touch LED component includes a metal cap, a touch button sheathed on an inner wall of the metal cap, and an LED lamp bead coupled to an inner wall of the touch button, a first through hole formed at the top of the metal cap, an induction pin installed at the bottom of the touch button, and an anode pin and a cathode pin installed on both sides of the bottom of the LED lamp bead respectively. The touch device includes a touch panel, a circuit board, and plural touch LED components. The touch LED component with high integration can be packaged by carrier tapes to facilitate automatic plug-ins and simplify production and assembling processes for mass production. The touch device has the features of simple structure, high reliability, good effect and long life.

A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components. The first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other.

The invention relates to an assembly with an electrotechnical component on a carrier, wherein the electrotechnical component is arranged on the carrier, wherein a first electrical connecting line and a second electrical connecting line going to the electrotechnical component are provided on or in the carrier, wherein the electrotechnical component comprises a first connection and a second connection, wherein the first connection is attached on the carrier by a thermally softenable solder material to the first electrical power supply line, and wherein the second connection is attached on the carrier by a thermally softenable solder material to the second electrical power supply line, wherein a first electrical signal line to the electrotechnical component is provided on or in the carrier, wherein the first connection on the carrier is also attached by a thermally softenable solder material to the first electrical signal line, wherein the assembly furthermore comprises a mechanical prestressing, which in the event that the solder material is softened can displace the electrotechnical component on the surface substantially in a parallel plane to the carrier or orthogonally to the carrier so that the electrical attachment of the first electrical power supply line, the second electrical power supply line and the first electrical signal line is interrupted such that a potential can now be measured between the first electrical power supply line and the first electrical signal line.

A depth-perceiving lens module with enhanced heat-dissipating properties comprises a circuit board, an infrared emitter, and an infrared receiver. The circuit board is provided with at least one positioning hole. The infrared emitter is detachably disposed on a side of the circuit board and electrically connected to the circuit board, the infrared emitter comprises a mounting body and an emitting body. The mounting body wraps at least part of the emitting body, at least part of the mounting body is disposed in the positioning hole and fixed to the circuit board. The infrared receiver is detachably disposed on one side of the circuit board and electrically connected to the circuit board, to receive the reflection of the infrared light from the light emitter.

A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components. The first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.

A socket connector includes a housing defining a pair of rows of insertion cavities and an elastic fastener formed on a bottom wall of each insertion cavity. Each row of insertion cavities has at least one insertion cavity. The elastic fastener is adapted to engage a plug connector inserted into the insertion cavity.

An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

A solid state drive (SSD) apparatus includes a body including a base plate and a sidewall extending along a periphery of the base plate, the sidewall including an upper sidewall protruding from an upper surface of the base plate and a lower sidewall protruding from a lower surface of the base plate, a first package substrate module housed in an area defined by the upper surface of the base plate and the upper sidewall, and a second package substrate module housed in an area defined by the lower surface of the base plate and the lower sidewall, wherein a height of the upper sidewall is greater than a height of the lower sidewall.