This disclosure relates generally to a reusable actuating device utilizing multiple integrated planar shape memory alloy elements integrated with independent driver circuits and at least one return spring integrated onto a single multi-layer PCB with a novel layout to create an electrically and mechanically redundant integrated actuator solution uniquely suited for use in low-profile devices that can be utilized by themselves or as an initiator in a staged device to release higher loads. The apparatus of the invention is particularly useful for spacecraft and other vehicular actuation devices.

A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components. The first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other.

A display device is provided. The display device includes: a display substrate having a non-display side, a first driver being provided at the non-display side of the display substrate; a touch module comprising a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board comprising a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion; and a supporting wall between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the supporting wall is located on at least one side of the first driver in a direction parallel to the flat portion of the touch flexible circuit board.

A solid state drive (SSD) apparatus includes a body including a base plate and a sidewall extending along a periphery of the base plate, the sidewall including an upper sidewall protruding from an upper surface of the base plate and a lower sidewall protruding from a lower surface of the base plate, a first package substrate module housed in an area defined by the upper surface of the base plate and the upper sidewall, and a second package substrate module housed in an area defined by the lower surface of the base plate and the lower sidewall, wherein a height of the upper sidewall is greater than a height of the lower sidewall.

A high-current connector and a high-current connection device, the high-current connection device comprises a circuit board and at least one group of (two) high-current connectors. Each high-current connector comprises a conductive mating member and a conductive combined shunt. The conductive mating member has a main body and an alignment soldering leg, the main body is formed as a columnar body and has a bottom surface and a top surface, the alignment soldering leg integrally extends from the bottom surface and protrudes from the bottom surface. The conductive combined shunt has a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins are positioned on both sides of the alignment soldering leg. The alignment soldering leg of the high-current connector is inserted into and electrically connected to the middle conductive holes of the circuit board, and the shunt pins of the high-current connector are respectively inserted into and electrically connected to the first conductive holes of the circuit board.

A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.

Display modules and chip on films are provided. The chip on film includes a body part and a first reinforcing part. The body part includes a first bonding portion, a second bonding portion, and a connecting portion connected between the first and second bonding portions. The first reinforcing part is connected to the first bonding portion and includes a first extending portion extending from at least one end of the first bonding portion in a direction away from the first bonding portion. The first bonding portion is provided with first bonding terminals arranged at intervals, the second bonding portion is provided with second bonding terminals arranged at intervals, the first extending portion is provided with at least one third bonding terminal, each first bonding terminal is electrically connected to a corresponding second bonding terminal, and the third bonding terminal is insulated from the second bonding terminals.

An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

A pet chest strap with a mount includes a chest strap body and a hardware holder fixed and locked to the chest strap body. The hardware holder has a locking assembly and a connecting terminal child-and-mother seat; the chest strap body includes a flexible printed circuit component with plural LED luminous bodies attached onto the flexible printed circuit component and packaged with a resin; the LED luminous bodies are connected to the connecting terminal child-and-mother seat of the hardware holder through the flexible printed circuit component. The invention has the features of powerful function, simple structure, and reasonable design and uses a hardware holder to achieve the effect of combining different hardware components to improve the environmental adaptability of the product, so as to meet the using requirements for different occasions and environments.

This disclosure generally relates to processor systems comprising printed circuit boards, I/O chips and processor chips with mated contacts. Contacts are formed on an upper surface of a printed circuit board having a through-hole and on a processor chip inside the through-hole. The processor chip may be a superconducting quantum processor chip comprising qubits, couplers, Digital to Analog converters, QFP shift registers and analog lines. Contacts are formed on an upper surface on an I/O chip and mated with the contacts on the printed circuit board and the processor chip. Contacts may be Indium bump bonds or superconducting solder bonds. The processor chip and the I/O chip may include a shield layer, a substrate layer and a thermally conductive layer.