Described herein are an electronic device and method for constructing same in which a rolled stacked electronic package includes one or more surface mounted embedded die modules. When the package is folded, the embedded die module and another surface mounted module are in contact with one another. The package increases circuit density and reduces microelectronic circuit size.

A hybrid system includes a printed circuit board (PCB) having a main surface, a package-on-package (PoP) having a bottom package mounted on the main surface of the PCB and a top package stacked on the bottom package, and a multi-chip package (MCP) on the main surface of the PCB. The bottom package includes a system-on-chip (SoC) and the top package includes at least one on-package dynamic random access memory (DRAM) die accessible to the SoC. The MCP includes at least one on-board DRAM die accessible to the SoC via a PCB trace.

The present disclosure relates to a printed circuit board, including: a first insulating layer having a through-portion; a chip stack including a first chip having a rear surface opposite to a front surface on which a connection pad is disposed, and a second chip attached to the rear surface of the first chip and having a different thickness from the first chip, wherein at least a portion of the chip stack is disposed in the through-portion.; and a second insulating layer covering at least a portion of each of the first insulating layer and the chip stack and disposed in at least a portion of the through-portion.

An input device may include: (a) a connector that recognizes a connection of an external device; (b) a switch located at an upper end portion of the connector and that connects an electrical signal when a physical input of a threshold pressure or more is pressed; (c) a substrate connected to a connection terminal of the switch and mounted at a surface in which the switch is not located; and/or (d) a key base that presses the switch.

A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

A wiring board includes a first interconnect structure including a first interconnect layer and a first insulating layer, a second interconnect structure, including a second interconnect layer and a second insulating layer, and laminated on one side of the first interconnect structure, and a third interconnect structure, including a third interconnect layer and a third insulating layer, and laminated on the other side of the first interconnect structure. The second interconnect layer has an interconnect density higher than those of the first and the third interconnect layers. The first insulating layer has a through hole penetrating the first insulating layer, and an electronic component electrically connected to the second interconnect layer is disposed inside the through hole. An embedding resin covering the electronic component is provided inside the through hole, and extends to cover the first insulating layer and fills in between the first and second insulating layers.

Techniques are disclosed for integrating the LED lead frame into the LED circuit fabrication process. The LED packages within the lead frame may be spaced according to the final spacing of the LED packages on the finished circuit board, such that multiple LED packages may be attached to a circuit board at a time by applying the lead frame to circuit board and then removing portions of the lead frame, leaving the LED packages attached to the board. The LED packages may be attached using solder or conductive epoxy, in some embodiments. Alternatively, part of the lead frame may include conductive wires forming one or more strings of LED packages. An entire string of LED packages may then be removed from the lead frame in a single motion and placement may be performed for a string of LED packages all at once rather than for individual LED packages.

An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.