The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

A circuit for EMC 1 in a power input circuit includes at least two wirings of a high-potential-side wiring 2 and a low-potential-side wiring 3 having different potentials and formed on a circuit board, a cutoff part 6 having one end connected to the high-potential-side wiring 2, a capacitor 10 connected between the other end of the cutoff part 6 and the low-potential-side wiring 3, a cutoff part 7 having one end connected to the high-potential-side wiring 2, a capacitor 20 connected between the other end of the cutoff part 7 and the low-potential-side wiring 3, and a capacitor 30 connected between a connection part 4 where the cutoff part 6 and the capacitor 10 are connected and a connection part 5 where the cutoff part 7 and the capacitor 20 are connected.

This disclosure generally relates to processor systems comprising printed circuit boards, I/O chips and processor chips with mated contacts. Contacts are formed on an upper surface of a printed circuit board having a through-hole and on a processor chip inside the through-hole. The processor chip may be a superconducting quantum processor chip comprising qubits, couplers, Digital to Analog converters, QFP shift registers and analog lines. Contacts are formed on an upper surface on an I/O chip and mated with the contacts on the printed circuit board and the processor chip. Contacts may be Indium bump bonds or superconducting solder bonds. The processor chip and the I/O chip may include a shield layer, a substrate layer and a thermally conductive layer.

Display modules and chip on films are provided. The chip on film includes a body part and a first reinforcing part. The body part includes a first bonding portion, a second bonding portion, and a connecting portion connected between the first and second bonding portions. The first reinforcing part is connected to the first bonding portion and includes a first extending portion extending from at least one end of the first bonding portion in a direction away from the first bonding portion. The first bonding portion is provided with first bonding terminals arranged at intervals, the second bonding portion is provided with second bonding terminals arranged at intervals, the first extending portion is provided with at least one third bonding terminal, each first bonding terminal is electrically connected to a corresponding second bonding terminal, and the third bonding terminal is insulated from the second bonding terminals.

A sensor module includes a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device, and a base including a first placement surface on which the first inertial sensor device is disposed, a second placement surface parallel to the first placement surface, on which the second inertial sensor device is disposed, and a third placement surface parallel to the first placement surface, on which the third inertial sensor device is disposed.

A circuit arrangement for capturing a position change of a component, comprising a printed circuit board. The component comprises a component portion with which the component is arranged on the printed circuit board and is aligned therewith. At least one movement direction is provided, in which the component moves in the event of a position change. At least one resistor is arranged in the movement direction with a tolerance distance from the component portion such that, in the event of a position change of the component, the tolerance distance is exceeded so that the component portion shears the resistor.

An integrated circuit assembly comprises an integrated circuit die and a substrate coupled to the integrated circuit die on a first mounting surface of the substrate. A printed circuit board has a hole formed therein, and is connected to the substrate connected on a second mounting surface of the substrate. A vertically integrated voltage regulator assembly comprises one or more inductors and one or more voltage regulation circuits, and is connected to the substrate at a physical location on a second mounting surface of the substrate opposite the first mounting surface of the substrate. At least a portion of the vertically integrated voltage regulator assembly and at least a portion of the substrate are intersected by an axis normal to and through the first and second mounting surfaces of the substrate, and the vertically integrated voltage regulator is disposed at least partially within the hole in the printed circuit board.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.