An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.

A connecting arrangement includes an electronic component and a printed circuit board, and a method includes establishing a solder connection between the component and circuit board. The component has a housing with a support area, and a contact element with a first contact area running parallel to the support area of the housing, a second contact area at a prespecified angle relative to the first contact area, and a rounded transition region formed between the first and second contact areas. The circuit board has a first surface with a soldering area including a constriction, a first section, and a second section connected to the first section via the constriction. The transition region is in a region of the constriction. The second contact area is connected to the second section via a solder connection. The support area is at an angle relative to the first surface corresponding to the prespecified angle.

A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.

A semiconductor device is to be mounted on a mount object by a solder. The semiconductor device includes a semiconductor element, an insulation member, and a plurality of terminals. The semiconductor element includes a plurality of electrodes. The insulation member covers the semiconductor element. The plurality of terminals is electrically connected to the plurality of electrodes. At least a part of the plurality of terminals is exposed outside the insulation member.

A printed circuit board includes a circuit trace and a connector pad. The connector pad provides electrical and mechanical mounting of a connector lead of a surface mount device and provides a circuit path between the surface mount device and the circuit trace. The connector pad includes 1) a connector pad base electrically coupled to the circuit trace, and 2) a first connector pad island electrically isolated from the connector pad base. The connector pad base has a length that is substantially equal to a length of a contact portion of the connector lead.

Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).

A portable communication device is provided that includes a display including a display area and a connecting area extending from one side of the display area; a back panel disposed on a rear surface of the display, the back panel including an opening formed therein; a flexible printed circuit board (FPCB) connected with the connecting area; and a biometric sensor electrically coupled with the FPCB, with the connecting area being housed and bent within the portable communication device such that the biometric sensor is placed under the opening.

A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect. Methods of testing continuity in electrical assemblies are also disclosed.

Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.